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MCH6337-TL-E

Onsemi

MCH6337-TL-E by Onsemi

The Onsemi MCH6337-TL-E is a P-CHANNEL FET with 4.5A max drain current and 1.5W power dissipation. Ideal for power management applications, it operates at up to 150°C with surface mount configuration for compact designs.

Median Price

$0.221

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 24,000 parts In-Stock

1+ parts

-

100+ parts

$0.198

1k+ parts

$0.164

10k+ parts

$0.147

24,000

-

$0.198

$0.164

$0.147

DigiKey

USA . 24,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.250

24,000

-

-

-

$0.250

Verical

USA . 24,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

$0.183

24,000

-

-

-

$0.183

RS (Exports)

UK . 1,800 parts In-Stock

1+ parts

-

100+ parts

$0.244

1k+ parts

$0.205

10k+ parts

-

1,800

-

$0.244

$0.205

-

Adafruit Industries

USA . 870 parts In-Stock

1+ parts

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870

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Distributors (In-Stock)

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Digiode

USA . 2,361 parts In-Stock

1+ parts

$0.155

100+ parts

-

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2,361

$0.155

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Vyrian

USA . 17,293 parts In-Stock

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17,293

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DigiKey Marketplace

USA . 12,916 parts In-Stock

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12,916

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Nova Conductors

Japan . 1,000 parts In-Stock

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1,000

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Distributors (Availability)

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Corohmni

South Africa . 172 parts In-Stock

1+ parts

$0.135

100+ parts

-

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172

$0.135

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Corphita

USA . 1,391 parts In-Stock

1+ parts

$0.147

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1,391

$0.147

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Aztec Data Supply Inc.

USA . 1,333 parts In-Stock

1+ parts

$1.792

100+ parts

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1,333

$1.792

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QUARKTWIN TECHNOLOGY LTD

USA . 27,875 parts In-Stock

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27,875

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Continental Prestige Electronics

USA . 24,000 parts In-Stock

1+ parts

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$0.149

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24,000

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$0.149

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Problanco Electronics

Mexico . 7,448 parts In-Stock

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7,448

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A-Z Elektronik GmbH

Germany . 5,412 parts In-Stock

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5,412

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Perfect Parts

USA . 5,247 parts In-Stock

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5,247

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TANS Electronics

Latvia . 3,985 parts In-Stock

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3,985

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SupplyDigital Components

Austria . 3,362 parts In-Stock

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3,362

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Argo Parts USA

USA . 3,054 parts In-Stock

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3,054

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Kulean Microsystems

USA . 2,652 parts In-Stock

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2,652

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Kepictronics

USA . 1,063 parts In-Stock

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1,063

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Advanced Electronics

New Zealand . 870 parts In-Stock

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870

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UHIMA Technologies

Türkiye . 346 parts In-Stock

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346

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Aranea Global

USA . 50 parts In-Stock

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50

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Overview

Upgrade your power systems with the MCH6337-TL-E by Onsemi, a top-quality P-CHANNEL Power FET that delivers reliable performance and efficiency. With a maximum drain current of 4.5A and maximum power dissipation of 1.5W, this transistor is perfect for a wide range of applications. Whether you're designing consumer electronics or industrial equipment, this single configuration FET offers unmatched value and benefits. Trust Onsemi's expertise in semiconductor technology to take your projects to the next level.

Feature Benefit Bullets

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their low on-resistance and high efficiency, making them a good choice for applications where power efficiency is important.

Configuration: SINGLE

Single configuration FETs are simpler to design with and implement, making them ideal for straightforward applications.

Surface Mount: YES

Surface mount FETs are easier to work with during PCB assembly, reducing production time and costs.

Maximum Drain Current (Abs) (ID): 4.5 A

With a maximum drain current of 4.5 A, this FET can handle moderate power loads, suitable for various applications.

Maximum Power Dissipation (Abs): 1.5 W

The low power dissipation of 1.5 W indicates that this FET operates efficiently and does not generate excessive heat during operation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology ensures stable and reliable performance, making this FET a dependable choice for power applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature of 150 °C, this FET can withstand elevated ambient temperatures without compromising performance.

Terminal Finish: Tin/Bismuth (Sn/Bi)

The tin/bismuth terminal finish provides good solderability and reliability, ensuring secure connections for the FET in the circuit.

Technical Specifications

Power Field Effect Transistors (FET) MCH6337-TL-E attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

4.5 A

Maximum Drain Current (ID):

4.5 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Trade Compliance

MCH6337-TL-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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