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MCH6336-TL-H

Onsemi

MCH6336-TL-H by Onsemi

MCH6336-TL-H by Onsemi is a P-CHANNEL FET with 5A max drain current and 1.5W power dissipation. Ideal for applications requiring high efficiency in power management systems, it operates at up to 150 °C with surface mount configuration for compact designs.

Median Price

$0.880

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 1,746 parts In-Stock

1+ parts

$1.560

100+ parts

$0.674

1k+ parts

$0.583

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1,746

$1.560

$0.674

$0.583

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DigiKey

USA . 18,000 parts In-Stock

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$0.200

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$0.200

Flip Electronics (Authorized)

USA . 18,000 parts In-Stock

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Distributors (In-Stock)

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Vyrian

USA . 461 parts In-Stock

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$0.151

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461

$0.151

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Digiode

USA . 558 parts In-Stock

1+ parts

$1.482

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558

$1.482

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Flip Electronics

USA . 18,000 parts In-Stock

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DigiKey Marketplace

USA . 18,000 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 125 parts In-Stock

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$0.151

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125

$0.151

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Corphita

USA . 620 parts In-Stock

1+ parts

$1.404

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620

$1.404

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Kepictronics

USA . 99,200 parts In-Stock

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Metaverse IC Inc.

Canada . 99,200 parts In-Stock

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Continental Prestige Electronics

USA . 60,000 parts In-Stock

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Perfect Parts

USA . 45,459 parts In-Stock

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Component Stockers USA

USA . 17,216 parts In-Stock

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$0.190

17,216

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$0.190

QUARKTWIN TECHNOLOGY LTD

USA . 10,946 parts In-Stock

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Problanco Electronics

Mexico . 8,140 parts In-Stock

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Kulean Microsystems

USA . 3,031 parts In-Stock

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Authorized Procurement Solutions

USA . 1,746 parts In-Stock

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1,746

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GreenTree Electronics

Israel . 1,746 parts In-Stock

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SupplyDigital Components

Austria . 1,167 parts In-Stock

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TANS Electronics

Latvia . 1,159 parts In-Stock

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UHIMA Technologies

Türkiye . 809 parts In-Stock

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Overview

Discover the power of efficiency and reliability with the MCH6336-TL-H P-CHANNEL Power Field Effect Transistor from Onsemi. Designed for single configuration applications, this surface-mount transistor offers a maximum drain current of 5A and a power dissipation of 1.5W, making it ideal for various power management tasks. With Onsemi's commitment to quality and innovation, you can trust that this METAL-OXIDE SEMICONDUCTOR technology will deliver consistent performance even in demanding conditions. Upgrade your electronic projects today with the MCH6336-TL-H and experience the difference that top-notch components can make.

Feature Benefit Bullets

Polarity or Channel Type: P-CHANNEL

P-CHANNEL FETs are known for their low on-state resistance, making them suitable for applications where low power dissipation is required.

Configuration: SINGLE

The single configuration simplifies circuit design and layout, making it easier to implement in various applications.

Surface Mount: YES

Surface mount technology allows for efficient placement on circuit boards, saving space and enabling automated assembly processes.

Maximum Drain Current (Abs) (ID): 5 A

With a high maximum drain current, this FET can handle higher power levels, making it suitable for applications requiring higher current capabilities.

Maximum Power Dissipation (Abs): 1.5 W

The low power dissipation of 1.5 W allows for efficient operation and helps in reducing heat generation, improving overall reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and reliability, making this FET a suitable choice for demanding applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this FET can withstand high temperatures, making it suitable for industrial and automotive applications.

Terminal Finish: Tin/Bismuth (Sn/Bi)

The tin/bismuth terminal finish provides good solderability and improved resistance to thermal stress, ensuring reliable connections in harsh environments.

Technical Specifications

Power Field Effect Transistors (FET) MCH6336-TL-H attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

5 A

Maximum Drain Current (ID):

5 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Trade Compliance

MCH6336-TL-H Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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