Loading...

MC74VHC257DT

Onsemi

MC74VHC257DT by Onsemi

MC74VHC257DT by Onsemi is a 4-function multiplexer with 2 inputs, operating at 3.3V. It features a propagation delay of 14.5ns and output characteristics in 3-STATE. Ideal for military-grade applications requiring high-speed data switching within a compact design.

Median Price

$0.119

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 960 parts In-Stock

1+ parts

-

100+ parts

$0.119

1k+ parts

$0.099

10k+ parts

$0.088

960

-

$0.119

$0.099

$0.088

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,155 parts In-Stock

1+ parts

$0.093

100+ parts

-

1k+ parts

-

10k+ parts

-

2,155

$0.093

-

-

-

Vyrian

USA . 2,655 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,655

-

-

-

-

R&J Components

USA . 1,720 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,720

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 756 parts In-Stock

1+ parts

$0.083

100+ parts

-

1k+ parts

-

10k+ parts

-

756

$0.083

-

-

-

Corphita

USA . 636 parts In-Stock

1+ parts

$0.088

100+ parts

-

1k+ parts

-

10k+ parts

-

636

$0.088

-

-

-

Corohmni

South Africa . 174 parts In-Stock

1+ parts

$0.098

100+ parts

-

1k+ parts

-

10k+ parts

-

174

$0.098

-

-

-

AZTECH Wire

Italy . 853 parts In-Stock

1+ parts

$19.090

100+ parts

-

1k+ parts

-

10k+ parts

-

853

$19.090

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 25,634 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

25,634

-

-

-

-

Microchip USA

USA . 5,196 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,196

-

-

-

-

SupplyDigital Components

Austria . 4,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,800

-

-

-

-

Problanco Electronics

Mexico . 4,328 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,328

-

-

-

-

Kulean Microsystems

USA . 1,695 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,695

-

-

-

-

TANS Electronics

Latvia . 1,692 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,692

-

-

-

-

Assy Fe

Spain . 200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

200

-

-

-

-

UHIMA Technologies

Türkiye . 57 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

57

-

-

-

-

Overview

Enhance your electronic designs with the MC74VHC257DT by Onsemi, a high-quality multiplexer/demultiplexer offering superior performance and reliability. Onsemi is known for its cutting-edge technology and innovative solutions, ensuring that this product meets the highest standards in the industry. With 4 functions, 2 inputs, and a 3-STATE output characteristic, this versatile component is perfect for a wide range of applications. Experience the value and benefits of this product, from its fast propagation delay to its wide operating temperature range. Trust Onsemi to deliver exceptional quality and functionality with the MC74VHC257DT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliability for long-term use.

Surface Mount: YES

Surface mount design allows for easy and convenient installation on PCBs.

No. of Functions: 4

Can handle multiple functions simultaneously, increasing efficiency.

No. of Inputs: 2

Having 2 inputs allows for more flexibility in signal routing and control.

Package Shape: RECTANGULAR

Rectangular shape helps in easier integration into circuit designs.

Nominal Supply Voltage / Vsup (V): 3.3

Operates efficiently at a standard voltage level of 3.3V.

Load Capacitance (CL): 50 pF

Capable of handling a load capacitance of 50 pF, making it suitable for various applications.

Power Supplies (V): 2/5.5

Supports a wide range of power supply voltages, offering versatility in usage.

No. of Terminals: 16

Sufficient number of terminals for connecting to other components in a circuit.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style saves space on the PCB and allows for high-density mounting.

Maximum I (ol): 8 Amp

High output current capacity of 8 Amps for handling heavy loads.

Propagation Delay (tpd): 14.5 ns

Low propagation delay ensures fast switching between inputs and outputs.

Maximum Operating Temperature: 125 °C

Capable of operating at high temperatures, suitable for industrial and military applications.

Output Characteristics: 3-STATE

3-state output provides flexibility in controlling the output signal.

Minimum Operating Temperature: -55 °C

Capable of operating in extreme cold conditions, making it versatile in various environments.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish for reliable connections and resistance to corrosion.

Terminal Position: DUAL

Dual terminal position for easy and secure mounting on PCBs.

Maximum Seated Height: 1.2 mm

Low profile design for space-saving and compact installations.

Width: 4.4 mm

Narrow width for efficient use of PCB space.

Output Polarity: TRUE

True output polarity ensures correct signal transmission.

Minimum Supply Voltage (Vsup): 2 V

Can operate at low supply voltages, suitable for battery-powered devices.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during the manufacturing process.

Length: 5 mm

Compact length for fitting into tight spaces on a PCB.

Temperature Grade: MILITARY

Meets military-grade standards for reliability and performance in harsh environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form for secure solder connections on PCBs.

Packing Method: RAIL

Rail packing method for easy handling and storage of multiple units.

Terminal Pitch: 0.65 mm

Fine terminal pitch for high-density mounting and connections.

Maximum Supply Voltage (Vsup): 5.5 V

Supports a high maximum supply voltage for versatility in power requirements.

Technical Specifications

Multiplexer & Demultiplexer MC74VHC257DT attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay (tpd):

14.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

MC74VHC257DT Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20