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MC74VHC1G86DFT2G

Onsemi

MC74VHC1G86DFT2G by Onsemi

MC74VHC1G86DFT2G by Onsemi is a logic gate with 2 inputs, 12 ns propagation delay, and 19.5 ns tpd. It operates at -55 to 125 °C and has a supply voltage range of 2-5.5 V. Ideal for applications requiring fast signal processing in compact spaces.

Median Price

$0.092

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

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Rochester

USA . 57,000 parts In-Stock

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$0.060

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$0.060

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$0.060

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Adafruit Industries

USA . 79 parts In-Stock

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$0.123

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$0.113

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$0.106

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79

$0.123

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Digiode

USA . 582 parts In-Stock

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Vyrian

USA . 7,552 parts In-Stock

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ComSIT Distribution GmbH

Germany . 6,750 parts In-Stock

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Inventory MP

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Bristol Electronics

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ACDS - Activité Composants Distribution Service

France . 899 parts In-Stock

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Dan-Mar Components

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Microfarads

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Nova Conductors

Japan . 150 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 28,523 parts In-Stock

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$0.051

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$0.050

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$0.049

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28,523

$0.051

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Ampacity Inc.

Singapore . 28,462 parts In-Stock

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$0.051

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Corphita

USA . 881 parts In-Stock

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$0.054

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Corohmni

South Africa . 460 parts In-Stock

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$0.060

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Advanced Electronics

New Zealand . 79 parts In-Stock

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$0.123

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$0.113

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$0.106

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79

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Continental Prestige Electronics

USA . 2,629 parts In-Stock

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$0.303

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$0.072

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$0.036

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2,629

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Aztec Data Supply Inc.

USA . 2,932 parts In-Stock

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$8.913

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AZTECH Wire

Italy . 884 parts In-Stock

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$10.650

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Perfect Parts

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Formix International (Excess)

India . 18,000 parts In-Stock

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RC Electronics

USA . 8,100 parts In-Stock

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TANS Electronics

Latvia . 7,339 parts In-Stock

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Microchip USA

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Lixinc

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QUARKTWIN TECHNOLOGY LTD

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SupplyDigital Components

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Kepictronics

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Authorized Procurement Solutions

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Argo Parts USA

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A-Z Elektronik GmbH

Germany . 1,629 parts In-Stock

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Problanco Electronics

Mexico . 1,429 parts In-Stock

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Kulean Microsystems

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Bastille Electronics

Australia . 500 parts In-Stock

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UHIMA Technologies

Türkiye . 92 parts In-Stock

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Overview

Discover the MC74VHC1G86DFT2G by Onsemi, a top-quality logic gate perfect for various applications. With a durable plastic/epoxy body and a compact design, this product boasts a quick propagation delay of just 12 ns. From military-grade technology to a wide temperature range, this logic gate offers unmatched reliability. Ideal for those seeking high performance in a small package, the MC74VHC1G86DFT2G is the ultimate solution for your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

Propagation Delay At Nominal Supply: 12 ns

With a fast propagation delay, this logic gate ensures quick signal processing and response times in electronic circuits.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto PCBs, saving space and enabling automated manufacturing processes.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a standard 3.3V supply voltage makes it compatible with a wide range of digital systems and components.

Load Capacitance (CL): 50 pF

The specified load capacitance helps in determining the amount of load a logic gate can drive, ensuring compatibility with different circuit configurations.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this logic gate can withstand elevated thermal conditions, suitable for industrial or automotive environments.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high noise immunity, making the logic gate energy-efficient and reliable in noisy environments.

Technical Specifications

Logic Gates MC74VHC1G86DFT2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

12 ns

Propagation Delay (tpd):

19.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

MC74VHC1G86DFT2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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