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MC74VHC1G04P5T5G-L22088

Onsemi

MC74VHC1G04P5T5G-L22088 by Onsemi

MC74VHC1G04P5T5G-L22088 by Onsemi is a CMOS Logic Gate with 3V nominal voltage, 14.5ns propagation delay, and 8A max I (ol). It is used in applications requiring fast signal processing and low power consumption in small outline designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,969 parts In-Stock

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Digiode

USA . 410 parts In-Stock

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Microchip USA

USA . 9,903 parts In-Stock

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$0.386

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AZTECH Wire

Italy . 297 parts In-Stock

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Component Stockers USA

USA . 516 parts In-Stock

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$99.990

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TANS Electronics

Latvia . 4,772 parts In-Stock

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Problanco Electronics

Mexico . 4,491 parts In-Stock

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Corphita

USA . 1,090 parts In-Stock

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UHIMA Technologies

Türkiye . 988 parts In-Stock

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Kulean Microsystems

USA . 513 parts In-Stock

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SupplyDigital Components

Austria . 486 parts In-Stock

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Corohmni

South Africa . 366 parts In-Stock

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Overview

Discover the cutting-edge MC74VHC1G04P5T5G-L22088 by Onsemi, a premium Logic Gates product that redefines efficiency and reliability in electronic applications. Crafted with precision using high-quality materials, this product offers exceptional performance with a nominal supply voltage of 3V and a maximum operating temperature of 125 °C. Perfect for a wide range of applications, this small outline, very thin profile package is designed to deliver optimal results while maximizing space utilization. Elevate your projects with the MC74VHC1G04P5T5G-L22088 and experience unparalleled value and benefits that cater to all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, ensuring reliability during operation.

Surface Mount: YES

Being surface mountable, this product is suitable for automated assembly processes, saving time and effort during production.

Nominal Supply Voltage / Vsup (V): 3

With a nominal supply voltage of 3V, this logic gate is compatible with a wide range of applications, offering flexibility in design.

Propagation Delay (tpd): 14.5 ns

The low propagation delay of 14.5 ns ensures fast signal processing, making this logic gate ideal for high-speed applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C allows this product to withstand elevated temperatures, providing reliable performance in various environments.

Technical Specifications

Logic Gates MC74VHC1G04P5T5G-L22088 attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-F5

Length:

1 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

FL5/6,.03,14

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay (tpd):

14.5 ns

Schmitt Trigger:

NO

Maximum Seated Height:

.4 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Width:

.8 mm

Trade Compliance

MC74VHC1G04P5T5G-L22088 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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