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MC74VHC1G04MU2TCG

Onsemi

MC74VHC1G04MU2TCG by Onsemi

MC74VHC1G04MU2TCG by Onsemi is a CMOS Logic Gate with 3V nominal voltage, 14.5ns propagation delay, and 50mA max power supply current. It is used in military-grade applications due to its -55 to 125 °C operating temperature range and small outline package style for space-constrained designs.

Median Price

$0.260

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,900 parts In-Stock

1+ parts

$0.260

100+ parts

$0.158

1k+ parts

-

10k+ parts

$0.072

1,900

$0.260

$0.158

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$0.072

DigiKey

USA . 40 parts In-Stock

1+ parts

$0.260

100+ parts

$0.158

1k+ parts

-

10k+ parts

$0.071

40

$0.260

$0.158

-

$0.071

Flip Electronics (Authorized)

USA . 336,000 parts In-Stock

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336,000

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Digiode

USA . 240 parts In-Stock

1+ parts

$0.618

100+ parts

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240

$0.618

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Flip Electronics

USA . 336,000 parts In-Stock

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336,000

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Vyrian

USA . 7,702 parts In-Stock

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7,702

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Distributors (Availability)

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Component Stockers USA

USA . 42 parts In-Stock

1+ parts

$0.440

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42

$0.440

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Corphita

USA . 2,196 parts In-Stock

1+ parts

$0.585

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2,196

$0.585

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Corohmni

South Africa . 191 parts In-Stock

1+ parts

$0.650

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191

$0.650

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Problanco Electronics

Mexico . 7,722 parts In-Stock

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7,722

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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TANS Electronics

Latvia . 4,309 parts In-Stock

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4,309

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Kulean Microsystems

USA . 2,288 parts In-Stock

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2,288

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UHIMA Technologies

Türkiye . 678 parts In-Stock

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678

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Microchip USA

USA . 217 parts In-Stock

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217

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SupplyDigital Components

Austria . 76 parts In-Stock

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Overview

Enhance your electronic projects with the MC74VHC1G04MU2TCG Logic Gate by Onsemi. Known for their superior quality and reliability, Onsemi delivers top-notch components that exceed industry standards. This versatile logic gate is perfect for a wide range of applications, offering fast propagation delay and low power consumption. With a compact design and high performance capabilities, this product provides exceptional value to customers looking to streamline their designs and enhance overall efficiency. Upgrade your projects today with the MC74VHC1G04MU2TCG from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to environmental factors, making the product reliable for long-term use.

Surface Mount: YES

Surface mountability allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 3

Suitable operating voltage of 3V ensures compatibility with a wide range of electronic devices and circuits.

Propagation Delay (tpd): 14.5 ns

Low propagation delay ensures fast signal processing, making the logic gates suitable for high-speed applications.

Maximum Operating Temperature: 125 °C

Wide operating temperature range of up to 125 °C ensures reliability in various environmental conditions.

Technical Specifications

Logic Gates MC74VHC1G04MU2TCG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-N6

Length:

1.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Functions:

1

No. of Inputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay (tpd):

14.5 ns

Schmitt Trigger:

NO

Maximum Seated Height:

.55 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1 mm

Trade Compliance

MC74VHC1G04MU2TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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