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MC74VHC1G00DFT2G-L22038

Onsemi

MC74VHC1G00DFT2G-L22038 by Onsemi

MC74VHC1G00DFT2G-L22038 by Onsemi is a logic gate with 15.5ns propagation delay at 3V, suitable for applications requiring fast signal processing. It features 2 inputs, operates b/w -55 to 125 °C, and has a max supply voltage of 5.5V. With a compact design and low power consumption (50mA ICC), it is ideal for space-constrained electronic devices.

Median Price

$0.300

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 978 parts In-Stock

1+ parts

$0.300

100+ parts

$0.115

1k+ parts

$0.086

10k+ parts

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978

$0.300

$0.115

$0.086

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 71 parts In-Stock

1+ parts

$0.062

100+ parts

-

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71

$0.062

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Digiode

USA . 2,365 parts In-Stock

1+ parts

$0.285

100+ parts

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2,365

$0.285

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Vyrian

USA . 5,341 parts In-Stock

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5,341

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 437 parts In-Stock

1+ parts

$0.061

100+ parts

-

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437

$0.061

-

-

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Netroflash

USA . 100 parts In-Stock

1+ parts

$0.062

100+ parts

-

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100

$0.062

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Ampacity Inc.

Singapore . 498 parts In-Stock

1+ parts

$0.255

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498

$0.255

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Corphita

USA . 1,817 parts In-Stock

1+ parts

$0.270

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-

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1,817

$0.270

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Component Stockers USA

USA . 798 parts In-Stock

1+ parts

$0.290

100+ parts

$0.110

1k+ parts

-

10k+ parts

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798

$0.290

$0.110

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AZTECH Wire

Italy . 253 parts In-Stock

1+ parts

$7.784

100+ parts

-

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253

$7.784

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Microchip USA

USA . 192 parts In-Stock

1+ parts

$23.730

100+ parts

$23.660

1k+ parts

$23.660

10k+ parts

$23.590

192

$23.730

$23.660

$23.660

$23.590

TANS Electronics

Latvia . 7,448 parts In-Stock

1+ parts

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7,448

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SupplyDigital Components

Austria . 7,305 parts In-Stock

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7,305

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Problanco Electronics

Mexico . 6,940 parts In-Stock

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6,940

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Kulean Microsystems

USA . 1,158 parts In-Stock

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1,158

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UHIMA Technologies

Türkiye . 987 parts In-Stock

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987

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Overview

Unlock the power of advanced technology with the MC74VHC1G00DFT2G-L22038 by Onsemi. This high-quality Logic Gate offers lightning-fast Propagation Delay, a wide operating temperature range, and a compact design for easy integration. Whether you're designing cutting-edge electronics, automating processes, or enhancing communication systems, this versatile component delivers unmatched performance and reliability. Trust Onsemi's expertise and innovation to take your projects to the next level. Experience the difference with the MC74VHC1G00DFT2G-L22038 today.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 15.5 ns

Low propagation delay ensures fast processing speed and efficiency.

Surface Mount: YES

Easy to mount on circuit boards, saving space and enabling automated assembly.

No. of Inputs: 2

Sufficient inputs for basic logic operations, suitable for small-scale circuits.

Nominal Supply Voltage (Vsup): 3 V

Compatible with common supply voltages, making it versatile and widely applicable.

Maximum Operating Temperature: 125 °C

Can operate reliably at high temperatures, suitable for a variety of environments.

Technical Specifications

Logic Gates MC74VHC1G00DFT2G-L22038 attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-XDSO-G5

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay At Nominal Supply:

15.5 ns

Propagation Delay (tpd):

15.5 ns

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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