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MC74LVXU04DG

Onsemi

MC74LVXU04DG by Onsemi

MC74LVXU04DG by Onsemi is a CMOS Logic Gates IC with 6 functions. It operates at 2-3.6V, has 11ns propagation delay, and can handle up to 50pF load capacitance. Ideal for industrial applications requiring fast signal processing in compact designs.

Median Price

$0.250

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 56,155 parts In-Stock

1+ parts

-

100+ parts

$0.260

1k+ parts

$0.215

10k+ parts

$0.192

56,155

-

$0.260

$0.215

$0.192

Verical

USA . 51,315 parts In-Stock

1+ parts

-

100+ parts

-

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$0.240

51,315

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-

-

$0.240

Distributors (In-Stock)

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Digiode

USA . 1,765 parts In-Stock

1+ parts

$0.202

100+ parts

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1,765

$0.202

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Vyrian

USA . 4,311 parts In-Stock

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4,311

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Distributors (Availability)

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Corphita

USA . 1,960 parts In-Stock

1+ parts

$0.192

100+ parts

-

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1,960

$0.192

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-

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Corohmni

South Africa . 229 parts In-Stock

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$0.213

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229

$0.213

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Component Stockers USA

USA . 61,346 parts In-Stock

1+ parts

$0.220

100+ parts

$0.200

1k+ parts

$0.180

10k+ parts

$0.180

61,346

$0.220

$0.200

$0.180

$0.180

AZTECH Wire

Italy . 594 parts In-Stock

1+ parts

$14.030

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594

$14.030

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Continental Prestige Electronics

USA . 56,155 parts In-Stock

1+ parts

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$0.198

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56,155

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$0.198

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TANS Electronics

Latvia . 7,618 parts In-Stock

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7,618

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SupplyDigital Components

Austria . 4,380 parts In-Stock

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Problanco Electronics

Mexico . 3,760 parts In-Stock

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3,760

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Kulean Microsystems

USA . 941 parts In-Stock

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941

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UHIMA Technologies

Türkiye . 869 parts In-Stock

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869

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Microchip USA

USA . 467 parts In-Stock

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467

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Overview

Onsemi's MC74LVXU04DG is a top-quality logic gate that offers unparalleled performance and reliability. With Onsemi's reputation for producing high-quality components, customers can trust in the durability and efficiency of this product. Ideal for various applications in electronics, this logic gate provides fast propagation delay and low power consumption, making it a valuable addition to any project. Experience the benefits of Onsemi's MC74LVXU04DG and take your designs to the next level with its superior quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to impact.

Propagation Delay At Nominal Supply: 11 ns

Low propagation delay ensures quick response times in logic operations, making the product efficient for high-speed applications.

Surface Mount: YES

Surface mount packaging allows for easy and compact integration onto circuit boards, saving space and facilitating automated assembly.

Nominal Supply Voltage / Vsup (V): 2.7

Operating at a low supply voltage of 2.7V helps in reducing power consumption and heat dissipation, making the product energy efficient.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, the product can withstand harsh environmental conditions, ensuring reliability in a variety of applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product suitable for battery-operated devices and noise-sensitive circuits.

Technical Specifications

Logic Gates MC74LVXU04DG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

11 ns

Propagation Delay (tpd):

16 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Trade Compliance

MC74LVXU04DG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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