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MC74LVX257MEL

Onsemi

MC74LVX257MEL by Onsemi

MC74LVX257MEL by Onsemi is a 4-function, 2-input multiplexer with a propagation delay of 13.5 ns at 3.3V supply voltage. It features a small outline package style and operates in industrial temperature range (-40 to 85 °C). Ideal for applications requiring high-speed signal switching in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,668 parts In-Stock

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Digiode

USA . 1,121 parts In-Stock

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AZTECH Wire

Italy . 595 parts In-Stock

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$11.930

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Problanco Electronics

Mexico . 7,834 parts In-Stock

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SupplyDigital Components

Austria . 5,673 parts In-Stock

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Kulean Microsystems

USA . 4,777 parts In-Stock

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TANS Electronics

Latvia . 4,638 parts In-Stock

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Corphita

USA . 871 parts In-Stock

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Corohmni

South Africa . 428 parts In-Stock

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UHIMA Technologies

Türkiye . 224 parts In-Stock

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Microchip USA

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Overview

Enhance your electronic projects with the MC74LVX257MEL from Onsemi, a top-tier manufacturer known for delivering high-quality components. This multiplexer & demultiplexer offers unparalleled efficiency and reliability, making it ideal for a wide range of applications. With its advanced technology and superior performance, this product guarantees seamless operation and precise results. Experience the value and benefits of Onsemi's MC74LVX257MEL, taking your projects to the next level with ease.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for applications where weight and durability are important factors.

Propagation Delay At Nominal Supply: 13.5 ns

The low propagation delay ensures fast signal processing, making this multiplexer/demultiplexer suitable for high-speed applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, making it convenient for mass production.

No. of Functions: 4

Having 4 functions in one device helps in saving board space and simplifying circuit designs.

Nominal Supply Voltage / Vsup (V): 2.7

The lower nominal supply voltage makes the product energy-efficient and suitable for applications where power consumption is a concern.

Load Capacitance (CL): 50 pF

The specified load capacitance ensures compatibility with various external components, offering flexibility in circuit design.

Power Supplies (V): 3.3

Operating at a standard power supply voltage of 3.3V ensures compatibility with common system voltages, making integration easier.

Maximum I (ol): 4 Amp

With a high maximum output current capability, this multiplexer/demultiplexer can drive loads efficiently and reliably.

Minimum Operating Temperature: -40 °C

The wide temperature range allows the product to operate in extreme conditions, making it versatile and suitable for various applications.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, enhancing the overall performance and efficiency of the device.

Technical Specifications

Multiplexer & Demultiplexer MC74LVX257MEL attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

3

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

13.5 ns

Propagation Delay (tpd):

18.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC74LVX257MEL Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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