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MC74LCX86MG

Onsemi

MC74LCX86MG by Onsemi

MC74LCX86MG by Onsemi is a 4-function logic gate with 2 inputs, operating at 3.3V. It features a propagation delay of 6.5ns and can handle load capacitance of 50pF. Ideal for industrial applications requiring fast signal processing in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 6,507 parts In-Stock

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Digiode

USA . 1,155 parts In-Stock

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AZTECH Wire

Italy . 873 parts In-Stock

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$20.750

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Component Stockers USA

USA . 748 parts In-Stock

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$99.990

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Kulean Microsystems

USA . 6,872 parts In-Stock

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Problanco Electronics

Mexico . 5,765 parts In-Stock

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SupplyDigital Components

Austria . 3,395 parts In-Stock

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TANS Electronics

Latvia . 2,299 parts In-Stock

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UHIMA Technologies

Türkiye . 626 parts In-Stock

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Corphita

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Microchip USA

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Corohmni

South Africa . 193 parts In-Stock

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Overview

Unleash the power of innovation with the Onsemi MC74LCX86MG logic gates! Manufactured by Onsemi, a leader in semiconductor technology, this product offers unmatched quality and reliability. Ideal for a wide range of applications, these logic gates provide fast propagation delay and low power consumption. With 4 functions and 2 inputs, they are perfect for industrial-grade projects that require precision and efficiency. Upgrade your systems today with the MC74LCX86MG and experience the seamless integration and superior performance that Onsemi products are known for.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 6.5 ns

Low propagation delay allows for fast signal processing, making this product suitable for high-speed applications.

No. of Functions: 4

Having 4 functions in one package increases efficiency and saves space in circuit design.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with commonly used supply voltages, making integration into existing systems easier.

Maximum Operating Temperature: 85 °C

Can operate at high temperatures, suitable for industrial applications where temperature fluctuations may occur.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable.

Technical Specifications

Logic Gates MC74LCX86MG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

3

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6.5 ns

Propagation Delay (tpd):

7 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.05 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC74LCX86MG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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