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MC74LCX32MEL

Onsemi

MC74LCX32MEL by Onsemi

MC74LCX32MEL by Onsemi is a CMOS Logic Gates IC with 4 functions and 2 inputs. It has a propagation delay of 5.5 ns at 2.5V, suitable for industrial applications requiring fast signal processing in compact designs. The small outline package with dual terminals and nickel palladium gold finish makes it ideal for surface mount PCBs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,626 parts In-Stock

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Digiode

USA . 1,977 parts In-Stock

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AZTECH Wire

Italy . 238 parts In-Stock

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$8.510

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Perfect Parts

USA . 29,120 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 15,393 parts In-Stock

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TANS Electronics

Latvia . 5,209 parts In-Stock

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Microchip USA

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RC Electronics

USA . 4,000 parts In-Stock

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$0.310

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$0.290

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$0.280

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Assy Fe

Spain . 4,000 parts In-Stock

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Kepictronics

USA . 3,985 parts In-Stock

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Problanco Electronics

Mexico . 3,763 parts In-Stock

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Kulean Microsystems

USA . 3,657 parts In-Stock

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Corphita

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SupplyDigital Components

Austria . 757 parts In-Stock

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Corohmni

South Africa . 283 parts In-Stock

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UHIMA Technologies

Türkiye . 53 parts In-Stock

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Overview

Discover the MC74LCX32MEL by Onsemi, a top-quality Logic Gates product that offers unmatched performance and reliability. With a manufacturer like Onsemi known for its cutting-edge technology, this product is perfect for a wide range of applications. The MC74LCX32MEL provides customers with exceptional value, benefits, and advantages, making it a must-have for any project requiring precision and efficiency. Experience the difference with Onsemi's MC74LCX32MEL today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

Propagation Delay At Nominal Supply: 5.5 ns

Low propagation delay ensures fast signal processing, making this product suitable for high-speed applications.

Surface Mount: YES

Easy installation on circuit boards and saves space, making it ideal for compact electronic devices.

Nominal Supply Voltage / Vsup (V): 2.5

Runs on a low supply voltage, making it energy-efficient and suitable for battery-powered devices.

No. of Terminals: 14

Provides sufficient connectivity options for various input and output configurations.

Propagation Delay (tpd): 6.6 ns

Ensures quick response time to input signals, improving overall system performance.

Maximum Operating Temperature: 85 °C

Can operate in high-temperature environments without compromising performance, suitable for industrial applications.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, enhancing overall reliability.

Technical Specifications

Logic Gates MC74LCX32MEL attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

5.5 ns

Propagation Delay (tpd):

6.6 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.05 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC74LCX32MEL Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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