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MC74LCX02MELG

Onsemi

MC74LCX02MELG by Onsemi

MC74LCX02MELG by Onsemi is a CMOS Logic Gates IC with 4 functions, 2 inputs, and 5.5 ns propagation delay at 2.5V. It operates in industrial temperature range (-40 to 85 °C) and has a small outline package for surface mount applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,570 parts In-Stock

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Digiode

USA . 618 parts In-Stock

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618

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AZTECH Wire

Italy . 411 parts In-Stock

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$21.100

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SupplyDigital Components

Austria . 7,471 parts In-Stock

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Corphita

USA . 2,164 parts In-Stock

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Problanco Electronics

Mexico . 2,091 parts In-Stock

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TANS Electronics

Latvia . 1,405 parts In-Stock

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Kulean Microsystems

USA . 1,015 parts In-Stock

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UHIMA Technologies

Türkiye . 624 parts In-Stock

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Microchip USA

USA . 339 parts In-Stock

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Corohmni

South Africa . 275 parts In-Stock

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Overview

Experience enhanced performance and reliability with the MC74LCX02MELG logic gates from Onsemi. Crafted with precision and quality materials, these logic gates offer unparalleled speed and efficiency in various applications. With a low propagation delay and high load capacitance, this product ensures seamless operation even in industrial settings. Say goodbye to compatibility issues and hello to smooth functionality with the MC74LCX02MELG by Onsemi. Upgrade your systems today and enjoy the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package durable and resistant to external factors, ensuring the reliability of the product.

Propagation Delay At Nominal Supply: 5.5 ns

Low propagation delay ensures fast signal processing, making this product suitable for applications requiring quick response times.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration into circuit boards, reducing assembly time and costs.

Nominal Supply Voltage / Vsup (V): 2.5

Operates at a low voltage which can help in reducing power consumption and heat generation, making it energy-efficient.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range enables this product to be used in harsh environments without compromising performance or reliability.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and high speed operation, making this product efficient and reliable for various applications.

Technical Specifications

Logic Gates MC74LCX02MELG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

5.5 ns

Propagation Delay (tpd):

6.6 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.05 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC74LCX02MELG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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