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MC74HCU04ANG

Onsemi

MC74HCU04ANG by Onsemi

MC74HCU04ANG by Onsemi is a CMOS Logic Gates IC with 6 functions, 21ns propagation delay at 3V. It operates in a temperature range of -55 to 125 °C and has a max supply voltage of 6V. Ideal for military-grade applications requiring fast signal processing in compact designs.

Median Price

$0.280

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 1,292 parts In-Stock

1+ parts

$1.590

100+ parts

$0.444

1k+ parts

$0.332

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1,292

$1.590

$0.444

$0.332

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Rochester

USA . 52,343 parts In-Stock

1+ parts

-

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$0.251

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$0.208

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$0.186

52,343

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$0.251

$0.208

$0.186

DigiKey

USA . 52,343 parts In-Stock

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$0.310

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52,343

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$0.310

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Verical

USA . 29,350 parts In-Stock

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$0.232

29,350

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$0.232

Distributors (In-Stock)

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Digiode

USA . 1,926 parts In-Stock

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$0.196

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$0.196

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Vyrian

USA . 8,354 parts In-Stock

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R&J Components

USA . 691 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,105 parts In-Stock

1+ parts

$0.185

100+ parts

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1,105

$0.185

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Corohmni

South Africa . 440 parts In-Stock

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$0.206

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440

$0.206

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AZTECH Wire

Italy . 646 parts In-Stock

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$18.820

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646

$18.820

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Continental Prestige Electronics

USA . 52,343 parts In-Stock

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$0.179

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52,343

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Perfect Parts

USA . 9,725 parts In-Stock

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Kulean Microsystems

USA . 7,425 parts In-Stock

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SupplyDigital Components

Austria . 7,421 parts In-Stock

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Microchip USA

USA . 5,839 parts In-Stock

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TANS Electronics

Latvia . 2,385 parts In-Stock

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Problanco Electronics

Mexico . 1,616 parts In-Stock

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Authorized Procurement Solutions

USA . 1,427 parts In-Stock

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GreenTree Electronics

Israel . 1,402 parts In-Stock

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UHIMA Technologies

Türkiye . 979 parts In-Stock

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979

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Overview

Elevate your logic gate game with the MC74HCU04ANG by Onsemi. Known for their top-notch quality and superior performance, Onsemi delivers cutting-edge technology in a compact rectangular package. With 6 functions packed into one component, this logic gate offers lightning-fast propagation delay at a nominal supply voltage of 3V, making it ideal for military-grade applications where precision is key. Experience the reliability and efficiency of Onsemi's MC74HCU04ANG and take your projects to the next level.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 21 ns

Low propagation delay ensures fast signal processing, making this logic gate suitable for high-speed applications.

Nominal Supply Voltage: 3V

Common supply voltage makes it compatible with a wide range of systems and applications.

Maximum Operating Temperature: 125 °C

High operating temperature range allows for reliable operation in various environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this logic gate energy-efficient and reliable.

Technical Specifications

Logic Gates MC74HCU04ANG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e3

Length:

18.86 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

21 ns

Propagation Delay (tpd):

105 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

4.69 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.62 mm

Trade Compliance

MC74HCU04ANG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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