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MC74HCU04AFEL

Onsemi

MC74HCU04AFEL by Onsemi

MC74HCU04AFEL by Onsemi is a CMOS Logic Gates IC with 6 functions, 21ns propagation delay at 3V. It has a small outline package, operates b/w -55 to 125 °C, and is suitable for military-grade applications.

Median Price

$0.114

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 18,000 parts In-Stock

1+ parts

-

100+ parts

$0.119

1k+ parts

$0.099

10k+ parts

$0.088

18,000

-

$0.119

$0.099

$0.088

Verical

USA . 10,000 parts In-Stock

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$0.110

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$0.110

Distributors (In-Stock)

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Digiode

USA . 637 parts In-Stock

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$0.093

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637

$0.093

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Vyrian

USA . 4,868 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,395 parts In-Stock

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$0.088

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$0.088

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Corohmni

South Africa . 287 parts In-Stock

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$0.098

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287

$0.098

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AZTECH Wire

Italy . 1,125 parts In-Stock

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$15.650

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$15.650

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$21.011

100+ parts

$19.120

1k+ parts

$17.229

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500

$21.011

$19.120

$17.229

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Continental Prestige Electronics

USA . 18,000 parts In-Stock

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$0.085

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$0.085

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QUARKTWIN TECHNOLOGY LTD

USA . 10,987 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,491 parts In-Stock

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Perfect Parts

USA . 5,057 parts In-Stock

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Kulean Microsystems

USA . 4,938 parts In-Stock

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Microchip USA

USA . 4,442 parts In-Stock

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Metaverse IC Inc.

Canada . 2,000 parts In-Stock

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Assy Fe

Spain . 1,360 parts In-Stock

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SupplyDigital Components

Austria . 1,173 parts In-Stock

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Problanco Electronics

Mexico . 1,082 parts In-Stock

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UHIMA Technologies

Türkiye . 312 parts In-Stock

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TANS Electronics

Latvia . 9 parts In-Stock

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Overview

Unleash the power of reliable logic gates with the MC74HCU04AFEL by Onsemi! Crafted with precision and quality materials, this product offers unparalleled performance and durability. Perfect for a variety of applications, these logic gates provide fast propagation delay and low power consumption. Trust Onsemi's expertise in semiconductor manufacturing to deliver a product that exceeds your expectations. Upgrade your projects with the MC74HCU04AFEL and experience seamless operation and unmatched efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product suitable for various applications.

Propagation Delay At Nominal Supply: 21 ns

Low propagation delay ensures fast signal transmission, improving overall performance.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into electronic circuits.

Nominal Supply Voltage / Vsup (V): 3

Operates at a commonly used voltage, making it compatible with a wide range of systems.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for harsh environments or industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable.

Technical Specifications

Logic Gates MC74HCU04AFEL attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5 Amp

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

21 ns

Propagation Delay (tpd):

105 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.05 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC74HCU04AFEL Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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