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MC74HC14ANG

Onsemi

MC74HC14ANG by Onsemi

MC74HC14ANG by Onsemi is a CMOS Logic Gates IC with 6 functions, 22ns propagation delay at 5V. Ideal for military-grade applications due to its Schmitt Trigger feature and wide operating temperature range from -55°C to 125°C. Package style is in-line with through-hole terminals, making it suitable for various electronic designs.

Median Price

$0.259

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 650 parts In-Stock

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$0.259

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Prism Electronics

USA . 5,524 parts In-Stock

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Vyrian

USA . 3,068 parts In-Stock

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Connector Distribution Corp

USA . 537 parts In-Stock

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Right Parts Inc.

USA . 537 parts In-Stock

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537

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North Shore Components

USA . 422 parts In-Stock

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Euro-Tech

UK . 380 parts In-Stock

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Digiode

USA . 176 parts In-Stock

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QIE Inc.

USA . 60 parts In-Stock

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Advanced Electronics

New Zealand . 270 parts In-Stock

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$0.234

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$0.234

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$0.234

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270

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Argo Parts USA

USA . 1,148 parts In-Stock

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$0.259

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$0.252

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Continental Prestige Electronics

USA . 1,092 parts In-Stock

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$0.259

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$0.254

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Netroflash

USA . 50 parts In-Stock

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$0.259

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$0.254

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AZTECH Wire

Italy . 513 parts In-Stock

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$17.577

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513

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Aztec Data Supply Inc.

USA . 2,071 parts In-Stock

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$25.230

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Ampacity Inc.

Singapore . 290 parts In-Stock

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$52.000

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Semicontronic

India . 513 parts In-Stock

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$53.000

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$51.675

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$51.410

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TANS Electronics

Latvia . 7,939 parts In-Stock

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Corphita

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SupplyDigital Components

Austria . 1,575 parts In-Stock

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Kulean Microsystems

USA . 597 parts In-Stock

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Problanco Electronics

Mexico . 541 parts In-Stock

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Corohmni

South Africa . 498 parts In-Stock

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Microchip USA

USA . 403 parts In-Stock

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Robosynatics

Brazil . 300 parts In-Stock

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Lucentia Tech

USA . 300 parts In-Stock

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$0.832

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$0.832

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$0.832

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$0.832

UHIMA Technologies

Türkiye . 63 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the MC74HC14ANG logic gate by Onsemi. Known for their superior quality and reliability, Onsemi products are trusted by professionals worldwide. The MC74HC14ANG offers fast propagation delay, low power consumption, and a wide operating temperature range, making it ideal for a variety of applications. Whether you're working on industrial automation, consumer electronics, or automotive systems, this logic gate will provide the efficiency and precision you need. Upgrade your projects with the MC74HC14ANG and experience the benefits of cutting-edge technology in a compact and durable package.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material that is suitable for various applications.

Propagation Delay At Nominal Supply: 22 ns

Fast response time allows for quick signal processing.

No. of Functions: 6

Versatile with multiple logic functions in a single package.

Nominal Supply Voltage / Vsup (V): 5

Works efficiently at a standard voltage supply of 5V.

Load Capacitance (CL): 50 pF

Can handle a reasonable load capacitance for smooth operations.

Power Supplies (V): 2/6

Compatible with a range of power supply voltages.

No. of Terminals: 14

Sufficient terminals for connectivity and integration with other components.

Maximum I (ol): 4 Amp

Capable of handling high output currents.

Propagation Delay (tpd): 110 ns

Overall low propagation delay for efficient signal transmission.

Maximum Operating Temperature: 125 °C

Can function reliably at high temperatures.

Minimum Operating Temperature: -55 °C

Suitable for use in a wide range of operating environments, including low temperatures.

Terminal Finish: Tin (Sn)

Provides corrosion resistance and a reliable electrical connection.

Technology: CMOS

Uses CMOS technology for low power consumption and high noise immunity.

Technical Specifications

Logic Gates MC74HC14ANG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e3

Length:

18.86 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

22 ns

Propagation Delay (tpd):

110 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

4.69 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

MC74HC14ANG Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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