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MC74HC14AFG

Onsemi

MC74HC14AFG by Onsemi

MC74HC14AFG by Onsemi is a CMOS Logic Gates IC with 6 functions. It has a propagation delay of 22ns at 3V, suitable for military-grade applications. The package is small outline, surface mountable, and features Schmitt Trigger technology.

Median Price

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Lifecycle Status

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2

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1k+

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Vyrian

USA . 7,004 parts In-Stock

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$14.090

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AZTECH Wire

Italy . 366 parts In-Stock

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TANS Electronics

Latvia . 7,658 parts In-Stock

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Kulean Microsystems

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Problanco Electronics

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Corphita

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SupplyDigital Components

Austria . 1,590 parts In-Stock

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UHIMA Technologies

Türkiye . 702 parts In-Stock

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Microchip USA

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Overview

Enhance the performance of your electronic projects with the MC74HC14AFG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality with this logic gates category product. With a quick propagation delay of 22ns, this surface mount device offers 6 functions in a rectangular package shape. Ideal for various applications, this small outline package provides a nominal supply voltage of 3V, ensuring efficient operation. Experience the benefits of reliable technology and high-quality materials with the MC74HC14AFG, making it the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, suitable for a wide range of applications.

Propagation Delay At Nominal Supply: 22 ns

With a low propagation delay of 22 ns at nominal supply voltage, this logic gate provides fast signal processing, making it ideal for time-sensitive applications.

Surface Mount: YES

Being surface mountable, this product offers easy installation and space-saving qualities, making it convenient for compact electronic designs.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V, this logic gate is energy-efficient and compatible with a variety of power sources.

Schmitt Trigger: YES

The inclusion of a Schmitt trigger allows for hysteresis in the input signal, improving noise immunity and signal stability in the output, ensuring reliable operation in noisy environments.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of voltages, making this logic gate versatile and efficient.

Technical Specifications

Logic Gates MC74HC14AFG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

22 ns

Propagation Delay (tpd):

110 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

2.05 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC74HC14AFG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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