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MC74HC00AFEL

Onsemi

MC74HC00AFEL by Onsemi

MC74HC00AFEL by Onsemi is a CMOS Logic Gates IC with 4 functions and 2 inputs. It has a propagation delay of 22 ns at Vsup of 3V, suitable for military-grade applications due to its operating temperature range of -55 to 125 °C. The package style is small outline, surface mountable, with a terminal pitch of 1.27 mm.

Median Price

$0.153

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 12,000 parts In-Stock

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-

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$0.159

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$0.132

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$0.117

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$0.159

$0.132

$0.117

Verical

USA . 8,000 parts In-Stock

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$0.147

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$0.147

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Digiode

USA . 892 parts In-Stock

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$0.124

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Vyrian

USA . 5,150 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1,504 parts In-Stock

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Corphita

USA . 1,111 parts In-Stock

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$0.117

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$0.117

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Corohmni

South Africa . 300 parts In-Stock

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$0.130

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$0.130

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AZTECH Wire

Italy . 333 parts In-Stock

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$11.910

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$11.910

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Continental Prestige Electronics

USA . 12,000 parts In-Stock

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$0.113

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Perfect Parts

USA . 6,026 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,763 parts In-Stock

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Problanco Electronics

Mexico . 5,579 parts In-Stock

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SupplyDigital Components

Austria . 4,620 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 2,690 parts In-Stock

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TANS Electronics

Latvia . 1,557 parts In-Stock

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Assy Fe

Spain . 1,523 parts In-Stock

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Kepictronics

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Kulean Microsystems

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UHIMA Technologies

Türkiye . 589 parts In-Stock

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Microchip USA

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Overview

Unlock the power of reliable and high-quality logic gates with the MC74HC00AFEL by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch performance and functionality in every product they make. Ideal for a wide range of applications, this logic gate offers fast propagation delay, low power consumption, and precise operation. Customers can trust in the value and benefits that this product brings to their projects, providing seamless integration and efficiency. Choose Onsemi for premium quality and superior performance in all your electronic designs.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 22 ns

Low propagation delay ensures fast response time, making this logic gate suitable for high-speed applications.

No. of Functions: 4

Having multiple functions in one device reduces the need for additional components and simplifies circuit design.

Nominal Supply Voltage: 3V

Compatible with common supply voltages, making integration into existing systems easier.

Maximum Operating Temperature: 125 °C

Can operate in high-temperature environments, increasing versatility and reliability.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it ideal for various applications.

Technical Specifications

Logic Gates MC74HC00AFEL attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

22 ns

Propagation Delay (tpd):

110 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.05 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC74HC00AFEL Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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