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MC74ACT11MELG

Onsemi

MC74ACT11MELG by Onsemi

MC74ACT11MELG by Onsemi is a Logic Gates IC with 3 functions and inputs. It operates at 5V, has a propagation delay of 10.5ns, and can handle load capacitance of 50pF. Widely used in industrial applications due to its small outline package and dual terminal position.

Median Price

$0.444

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 25,295 parts In-Stock

1+ parts

-

100+ parts

$0.436

1k+ parts

$0.362

10k+ parts

$0.323

25,295

-

$0.436

$0.362

$0.323

Verical

USA . 25,295 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.452

10k+ parts

$0.403

25,295

-

-

$0.452

$0.403

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,346 parts In-Stock

1+ parts

$0.339

100+ parts

-

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-

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1,346

$0.339

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-

-

Vyrian

USA . 9,255 parts In-Stock

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-

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9,255

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 25,151 parts In-Stock

1+ parts

$0.303

100+ parts

-

1k+ parts

-

10k+ parts

-

25,151

$0.303

-

-

-

Corphita

USA . 2,089 parts In-Stock

1+ parts

$0.321

100+ parts

-

1k+ parts

-

10k+ parts

-

2,089

$0.321

-

-

-

Corohmni

South Africa . 332 parts In-Stock

1+ parts

$0.357

100+ parts

-

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10k+ parts

-

332

$0.357

-

-

-

Component Stockers USA

USA . 21,509 parts In-Stock

1+ parts

$0.370

100+ parts

$0.350

1k+ parts

$0.310

10k+ parts

$0.310

21,509

$0.370

$0.350

$0.310

$0.310

AZTECH Wire

Italy . 666 parts In-Stock

1+ parts

$10.790

100+ parts

-

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-

10k+ parts

-

666

$10.790

-

-

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Continental Prestige Electronics

USA . 25,295 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.310

10k+ parts

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25,295

-

-

$0.310

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Kulean Microsystems

USA . 8,001 parts In-Stock

1+ parts

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8,001

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Problanco Electronics

Mexico . 6,654 parts In-Stock

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6,654

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TANS Electronics

Latvia . 4,776 parts In-Stock

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4,776

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Microchip USA

USA . 4,590 parts In-Stock

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4,590

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SupplyDigital Components

Austria . 2,655 parts In-Stock

1+ parts

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2,655

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UHIMA Technologies

Türkiye . 263 parts In-Stock

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263

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Overview

Experience superior performance and reliability with the MC74ACT11MELG by Onsemi, a leading manufacturer in the industry. This Logic Gate offers fast propagation delay at nominal supply, making it ideal for a wide range of applications. With its high-quality construction and advanced technology, this product ensures seamless operation and precise results. Trust Onsemi for top-notch products that deliver exceptional value and efficiency to meet your needs. Elevate your projects with the MC74ACT11MELG and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components due to its durability and cost-effectiveness.

Propagation Delay At Nominal Supply: 10.5 ns

Low propagation delay ensures fast operation and response times in logic circuits.

Surface Mount: YES

Suitable for automated assembly processes, making it easier to integrate into electronic designs.

No. of Functions: 3

Multiple functions in a single package reduce the need for additional components, saving space and cost.

Nominal Supply Voltage / Vsup (V): 5

Operates at standard 5V supply voltage, compatible with most electronic systems.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for efficient logic gates.

Technical Specifications

Logic Gates MC74ACT11MELG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

ACT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

3

No. of Inputs:

3

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.05 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC74ACT11MELG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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