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MC74AC157DTR2

Onsemi

MC74AC157DTR2 by Onsemi

MC74AC157DTR2 by Onsemi is a 4-function multiplexer with 2 inputs, 13ns propagation delay, and 9ns tpd. Ideal for industrial applications, it operates at -40 to 85 °C with Vsup ranging from 2V to 6V. Package style: SOIC-16, surface mountable.

Median Price

$0.172

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 200 parts In-Stock

1+ parts

$21.402

100+ parts

$19.476

1k+ parts

$17.550

10k+ parts

-

200

$21.402

$19.476

$17.550

-

Rochester

USA . 12,500 parts In-Stock

1+ parts

-

100+ parts

$0.172

1k+ parts

$0.143

10k+ parts

$0.127

12,500

-

$0.172

$0.143

$0.127

Verical

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.159

10,000

-

-

-

$0.159

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,095 parts In-Stock

1+ parts

$0.134

100+ parts

-

1k+ parts

-

10k+ parts

-

2,095

$0.134

-

-

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Vyrian

USA . 6,022 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,022

-

-

-

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Zilex Electronics Inc.

Canada . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,500

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 293 parts In-Stock

1+ parts

$0.122

100+ parts

-

1k+ parts

-

10k+ parts

-

293

$0.122

-

-

-

Corphita

USA . 145 parts In-Stock

1+ parts

$0.127

100+ parts

-

1k+ parts

-

10k+ parts

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145

$0.127

-

-

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AZTECH Wire

Italy . 946 parts In-Stock

1+ parts

$13.060

100+ parts

-

1k+ parts

-

10k+ parts

-

946

$13.060

-

-

-

Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$21.402

100+ parts

$19.476

1k+ parts

$17.550

10k+ parts

-

200

$21.402

$19.476

$17.550

-

Continental Prestige Electronics

USA . 12,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.122

10k+ parts

-

12,500

-

-

$0.122

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Microchip USA

USA . 7,297 parts In-Stock

1+ parts

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100+ parts

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7,297

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Problanco Electronics

Mexico . 5,321 parts In-Stock

1+ parts

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100+ parts

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5,321

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Kulean Microsystems

USA . 4,022 parts In-Stock

1+ parts

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100+ parts

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4,022

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SupplyDigital Components

Austria . 1,720 parts In-Stock

1+ parts

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1,720

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TANS Electronics

Latvia . 502 parts In-Stock

1+ parts

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502

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UHIMA Technologies

Türkiye . 237 parts In-Stock

1+ parts

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1k+ parts

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237

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Overview

Upgrade your electronic devices with the MC74AC157DTR2 by Onsemi, a high-quality multiplexer & demultiplexer that offers unparalleled performance and reliability. Onsemi is known for its cutting-edge technology and innovation in the industry, making this product a top choice for various applications. With fast propagation delay, low power consumption, and excellent temperature tolerance, this versatile component guarantees seamless operation and enhanced functionality. Experience the value and benefits of Onsemi's MC74AC157DTR2 - the ultimate solution for your electronic circuit needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the multiplexer/demultiplexer.

Propagation Delay At Nominal Supply: 13 ns

The low propagation delay ensures fast signal processing, making this product suitable for applications requiring quick data transmission.

Surface Mount: YES

The surface mount capability allows for easy and convenient installation on circuit boards, saving space and simplifying assembly processes.

No. of Functions: 4

With multiple functions, this multiplexer/demultiplexer offers versatile signal routing options for various applications.

No. of Inputs: 2

Having two inputs provides flexibility in connecting multiple input sources to the device, expanding the range of compatible devices.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage ensures compatibility with standard power sources, making it easy to integrate into existing systems.

Load Capacitance (CL): 50 pF

The load capacitance specification helps ensure optimal performance and signal integrity when interfacing with external components.

Power Supplies (V): 3.3/5

Support for multiple power supply voltages gives users flexibility in powering the device according to their specific requirements.

No. of Terminals: 16

The 16 terminals allow for easy connectivity and signal routing, enabling seamless integration into complex circuit designs.

Maximum I (ol): 12 Amp

The high output current capability of 12 Amps ensures the device can drive heavy loads or multiple devices without overheating or performance degradation.

Propagation Delay (tpd): 9 ns

The low propagation delay of 9 ns further enhances the speed and efficiency of signal processing, making this product ideal for high-speed data applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this device can withstand extended operation in demanding environments without overheating.

Minimum Operating Temperature: -40 °C

The wide temperature range from -40 °C to 85°C ensures reliable operation in both extreme cold and hot conditions, making this product suitable for various environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish of nickel palladium gold provides excellent corrosion resistance and ensures reliable signal transmission over time, increasing the product's longevity.

Terminal Position: DUAL

The dual terminal position offers flexibility in mounting and installation choices, accommodating different circuit board layouts and designs.

Maximum Seated Height: 1.2 mm

The compact maximum seated height of 1.2 mm allows for a low-profile design, saving space in crowded circuit board layouts and enabling more efficient use of space.

Width: 4.4 mm

The small width dimension of 4.4 mm enables easy integration into tight spaces or densely packed circuit board assemblies, improving overall design flexibility.

Output Polarity: TRUE

The true output polarity ensures accurate signal processing and transmission, reducing the risk of errors or signal distortions in data communication.

Minimum Supply Voltage (Vsup): 2 V

Support for a low minimum supply voltage of 2V allows for operation in low-power environments or battery-powered applications without sacrificing performance.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260 °C, the device can withstand high-temperature soldering processes during assembly, ensuring reliable connections and durability.

Length: 5 mm

The compact length dimension of 5 mm contributes to the overall small form factor of the device, making it ideal for applications with space constraints.

Temperature Grade: INDUSTRIAL

The industrial temperature grade rating ensures reliable operation in harsh industrial environments, making this product suitable for a wide range of industrial applications.

Technology: CMOS

The CMOS technology used in this device offers low power consumption, high noise immunity, and fast switching speeds, making it ideal for energy-efficient and high-performance applications.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and reliable soldering connections, ensuring robust performance and durability in various operating conditions.

Packing Method: TR

The TR packing method (tape and reel) offers convenient transportation, storage, and assembly of multiple devices, streamlining manufacturing processes and reducing handling time.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm allows for high-density mounting and precise connections on circuit boards, optimizing space usage and enabling compact designs.

Maximum Supply Voltage (Vsup): 6 V

The maximum supply voltage of 6V provides a wide operating voltage range, making this product versatile and compatible with a variety of power sources and applications.

Technical Specifications

Multiplexer & Demultiplexer MC74AC157DTR2 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Additional Features:

TTL COMPATIBLE INPUTS

Family:

AC

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Propagation Delay At Nominal Supply:

13 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

MC74AC157DTR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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