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MC14584BFEL

Onsemi

MC14584BFEL by Onsemi

MC14584BFEL by Onsemi is a 6-function logic gate with 250 ns propagation delay at 5V. It features Schmitt Trigger technology, operates b/w -55 to 125 °C, and has a small outline package for military-grade applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 8,354 parts In-Stock

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Extreme Components

USA . 4,000 parts In-Stock

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Digiode

USA . 806 parts In-Stock

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AZTECH Wire

Italy . 477 parts In-Stock

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$19.660

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Kulean Microsystems

USA . 6,743 parts In-Stock

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SupplyDigital Components

Austria . 5,589 parts In-Stock

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Kepictronics

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Assy Fe

Spain . 2,305 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,800 parts In-Stock

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Problanco Electronics

Mexico . 1,711 parts In-Stock

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TANS Electronics

Latvia . 1,630 parts In-Stock

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Perfect Parts

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Authorized Procurement Solutions

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Corohmni

South Africa . 496 parts In-Stock

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Microchip USA

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UHIMA Technologies

Türkiye . 131 parts In-Stock

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Corphita

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Overview

Unleash the power of the MC14584BFEL by Onsemi, a top-quality logic gate that offers unrivaled performance for a wide range of applications. Manufactured by industry leader Onsemi, this product boasts superior reliability and efficiency, making it a must-have for any project. With its advanced technology and innovative design, the MC14584BFEL delivers exceptional value, benefits, and advantages to customers seeking a high-performing solution. Upgrade your systems with this cutting-edge logic gate and experience a new level of performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight, durable, and cost-effective.

Propagation Delay At Nominal Supply: 250 ns

Low propagation delay ensures fast operation of the logic gates, making them suitable for high-speed applications.

Surface Mount: YES

Surface mountability makes it easy to integrate these logic gates onto a circuit board, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 5

Standard 5V supply voltage ensures compatibility with a wide range of electronic systems.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the circuit board, enabling compact designs.

Minimum Operating Temperature: -55 °C

Wide operating temperature range makes these logic gates suitable for use in extreme environments.

Schmitt Trigger: YES

Schmitt trigger functionality helps in reducing noise, making the logic gates more reliable in noisy environments.

Technology: MOS

MOS technology offers low power consumption and fast switching speeds, making the logic gates energy-efficient and suitable for high-speed applications.

Technical Specifications

Logic Gates MC14584BFEL attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

250 ns

Propagation Delay (tpd):

250 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

2.05 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

MOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC14584BFEL Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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