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MC14512BDG

Onsemi

MC14512BDG by Onsemi

MC14512BDG by Onsemi is an 8-input multiplexer with a propagation delay of 650 ns at 5V. It operates in a temperature range of -55 to 125 °C and supports power supplies of 5/15V. Ideal for military-grade applications requiring CMOS technology and small outline packaging.

Median Price

$0.199

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 17,808 parts In-Stock

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$0.180

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Rochester

USA . 186 parts In-Stock

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$0.218

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$0.181

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$0.161

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Distributors (In-Stock)

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Flip Electronics

USA . 17,808 parts In-Stock

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$0.120

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Vyrian

USA . 839 parts In-Stock

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Digiode

USA . 1,408 parts In-Stock

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DigiKey Marketplace

USA . 17,808 parts In-Stock

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ComSIT Distribution GmbH

Germany . 162 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 15 parts In-Stock

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Cogito LLC

Ukraine . 8 parts In-Stock

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Ampacity Inc.

Singapore . 8,844 parts In-Stock

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$0.153

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Corohmni

South Africa . 254 parts In-Stock

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Corphita

USA . 1,669 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 12,244 parts In-Stock

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Perfect Parts

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Problanco Electronics

Mexico . 7,431 parts In-Stock

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Microchip USA

USA . 5,126 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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TANS Electronics

Latvia . 2,789 parts In-Stock

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Kulean Microsystems

USA . 950 parts In-Stock

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Metaverse IC Inc.

Canada . 515 parts In-Stock

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SupplyDigital Components

Austria . 335 parts In-Stock

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UHIMA Technologies

Türkiye . 214 parts In-Stock

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Kepictronics

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Overview

Experience the unmatched quality of Onsemi with the MC14512BDG Multiplexer & Demultiplexer. This versatile component offers a wide range of applications, providing customers with exceptional value and benefits. With a focus on reliability and efficiency, Onsemi delivers cutting-edge technology that surpasses industry standards. Trust in Onsemi to meet your needs with precision and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and reliability for long-term use

Propagation Delay At Nominal Supply: 650 ns

Fast propagation delay ensures efficient data transmission

Surface Mount: YES

Allows for easy installation on PCBs

No. of Inputs: 8

Provides the capability to handle multiple input signals

Nominal Supply Voltage / Vsup (V): 5

Standard 5V supply voltage for compatibility with various systems

Load Capacitance (CL): 50 pF

Optimized load capacitance for efficient signal processing

Power Supplies (V): 5/15

Supports both 5V and 15V power supplies for flexibility in use

Package Style (Meter): SMALL OUTLINE

Compact small outline package for space-saving installation

Output Characteristics: 3-STATE

3-state output allows for high impedance when not in use, reducing power consumption

Minimum Operating Temperature: -55 °C

Wide temperature range for operation in harsh environments

Technical Specifications

Multiplexer & Demultiplexer MC14512BDG attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

650 ns

Propagation Delay (tpd):

650 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC14512BDG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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