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MC14512BFG

Onsemi

MC14512BFG by Onsemi

MC14512BFG by Onsemi is an 8-input Multiplexer & Demultiplexer with a Propagation Delay of 650 ns at 5V. It operates in a temperature range of -55 to 125 °C and supports a load capacitance of 50 pF. Ideal for military applications due to its CMOS technology and small outline package style.

Median Price

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Lifecycle Status

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2

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< 1k

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Vyrian

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Digiode

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TANS Electronics

Latvia . 4,273 parts In-Stock

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Kulean Microsystems

USA . 3,391 parts In-Stock

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SupplyDigital Components

Austria . 2,757 parts In-Stock

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Corphita

USA . 1,577 parts In-Stock

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Problanco Electronics

Mexico . 820 parts In-Stock

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Corohmni

South Africa . 464 parts In-Stock

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UHIMA Technologies

Türkiye . 251 parts In-Stock

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Overview

Looking for a reliable multiplexer and demultiplexer for your electronic projects? Look no further than the MC14512BFG by Onsemi. With a reputation for high-quality products, Onsemi delivers excellence in every component they produce. The MC14512BFG offers 3-STATE output characteristics, a wide operating temperature range, and efficient power consumption, making it perfect for a variety of applications. Upgrade your projects with the value and benefits that only Onsemi can provide. Trust in Onsemi for all your electronic component needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for portable or rugged applications.

Propagation Delay At Nominal Supply: 650 ns

The low propagation delay ensures fast signal processing, making this multiplexer/demultiplexer suitable for high-speed applications.

Surface Mount: YES

Being surface mountable makes installation and PCB assembly easier, saving time and effort during manufacturing.

Nominal Supply Voltage / Vsup (V): 5

Standard nominal supply voltage of 5V makes it compatible with common power sources, simplifying integration into existing systems.

Load Capacitance (CL): 50 pF

The low load capacitance helps in reducing signal distortion and maintaining signal integrity, making the product suitable for high-frequency applications.

Temperature Grade: MILITARY

The military-grade temperature range ensures reliable operation in extreme environmental conditions, making this product suitable for harsh environments.

Technical Specifications

Multiplexer & Demultiplexer MC14512BFG attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

650 ns

Propagation Delay (tpd):

650 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC14512BFG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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