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MC14512BCP

Onsemi

MC14512BCP by Onsemi

MC14512BCP by Onsemi is a CMOS Multiplexer & Demultiplexer with 8 inputs, 650 ns propagation delay at 5V. It operates in a temperature range of -55 to 125 °C and has a package style of IN-LINE. Ideal for military applications due to its robust design and performance.

Median Price

$1.610

Lifecycle Status

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1k+

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TEDSS.com

USA . 100 parts In-Stock

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Component Electronics Inc.

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Corohmni

South Africa . 133 parts In-Stock

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Overview

Experience unparalleled quality and reliability with the MC14512BCP from Onsemi, a leading manufacturer in the industry. This versatile Multiplexer & Demultiplexer boasts a wide range of applications, offering customers unmatched value and benefits. With a nominal supply voltage of 5V and a maximum operating temperature of 125 °C, this product ensures optimal performance in any environment. Trust Onsemi to deliver cutting-edge technology and superior products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the internal components of the multiplexer/demultiplexer.

Propagation Delay At Nominal Supply: 650 ns

The low propagation delay of 650 ns ensures efficient and fast data processing within the multiplexer/demultiplexer.

No. of Inputs: 8

Having 8 inputs allows the multiplexer/demultiplexer to handle multiple input signals simultaneously, making it versatile for various applications.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage ensures compatibility with standard power sources, making it easy to integrate into existing systems.

Load Capacitance (CL): 50 pF

The 50 pF load capacitance helps in stabilizing the signal and ensuring smooth transmission within the multiplexer/demultiplexer.

Power Supplies (V): 5/15

Having multiple power supply options (5V and 15V) adds flexibility in powering the multiplexer/demultiplexer according to specific requirements.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, the multiplexer/demultiplexer can function reliably even in elevated temperature environments.

Output Characteristics: 3-STATE

The 3-STATE output characteristics provide additional flexibility in managing the output signals, allowing for tri-state logic functionality.

Temperature Grade: MILITARY

Being classified as MILITARY grade ensures that the multiplexer/demultiplexer meets high standards of reliability and performance under harsh conditions.

Technical Specifications

Multiplexer & Demultiplexer MC14512BCP attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

Length:

19.175 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

235

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

650 ns

Propagation Delay (tpd):

650 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.44 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn80Pb20)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.62 mm

Trade Compliance

MC14512BCP Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-049-1492, 5962010491492

NIIN

010491492

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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