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MC14512BCPG

Onsemi

MC14512BCPG by Onsemi

MC14512BCPG by Onsemi is an 8-input Multiplexer & Demultiplexer with a propagation delay of 650 ns at 5V. It operates in a temperature range of -55 to 125 °C and supports supply voltages from 3V to 18V. Ideal for military-grade applications requiring CMOS technology and true output polarity.

Median Price

$0.296

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Nova Conductors

Japan . 69 parts In-Stock

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Vyrian

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Digiode

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ACDS - Activité Composants Distribution Service

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Holdelec - ElecDif-Pro

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Euro-Tech

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Prism Electronics

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Netroflash

USA . 100 parts In-Stock

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$0.281

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AZTECH Wire

Italy . 275 parts In-Stock

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$5.172

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Ampacity Inc.

Singapore . 1,087 parts In-Stock

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Kepictronics

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TANS Electronics

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Problanco Electronics

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Corphita

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Kulean Microsystems

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SupplyDigital Components

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UHIMA Technologies

Türkiye . 385 parts In-Stock

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Corohmni

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Microchip USA

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Perfect Parts

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Overview

Maximize your circuit design efficiency with the MC14512BCPG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers superior quality and reliability in their products. The MC14512BCPG falls under the Multiplexer & Demultiplexer category, offering versatility and flexibility for various applications. With a low propagation delay of 650 ns and 8 inputs, this product ensures quick and efficient signal processing. Trust in Onsemi's reputation for excellence and experience the value and benefits that the MC14512BCPG brings to your projects. Upgrade your designs today with Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package durable and lightweight, ensuring reliable performance and easy handling.

Propagation Delay At Nominal Supply: 650 ns

With a fast propagation delay, this multiplexer & demultiplexer provides efficient and quick data processing.

No. of Inputs: 8

Having 8 inputs allows for versatile input options and connectivity, making it suitable for various applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes this product compatible with common power sources.

Load Capacitance (CL): 50 pF

The low load capacitance helps in reducing signal distortion and enhancing the overall signal integrity.

Power Supplies (V): 5/15

Supporting dual power supply options of 5V and 15V provides flexibility in power configurations based on the requirements of the system.

Output Characteristics: 3-STATE

The 3-state output feature allows the output to be in high impedance state, enabling multiple devices to be connected without interference.

Minimum Operating Temperature: -55 °C

The wide temperature range of -55 to 125°C ensures reliable operation in various environmental conditions.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable.

Technical Specifications

Multiplexer & Demultiplexer MC14512BCPG attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e3

Length:

19.175 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

650 ns

Propagation Delay (tpd):

650 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.44 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

MC14512BCPG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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