Loading...

MC14512BDR2G

Onsemi

MC14512BDR2G by Onsemi

MC14512BDR2G by Onsemi is an 8-input multiplexer with a propagation delay of 650 ns at 5V. It operates in a temperature range of -55 to 125°C and supports a supply voltage range of 3-18V. Ideal for military-grade applications requiring high-speed signal switching in compact designs.

Median Price

$0.560

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 4,325 parts In-Stock

1+ parts

$0.540

100+ parts

$0.322

1k+ parts

$0.279

10k+ parts

$0.248

4,325

$0.540

$0.322

$0.279

$0.248

DigiKey

USA . 4,364 parts In-Stock

1+ parts

$0.580

100+ parts

$0.321

1k+ parts

$0.278

10k+ parts

$0.255

4,364

$0.580

$0.321

$0.278

$0.255

Adafruit Industries

USA . 2,000 parts In-Stock

1+ parts

$25.618

100+ parts

$23.312

1k+ parts

$21.007

10k+ parts

-

2,000

$25.618

$23.312

$21.007

-

Arrow

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.227

5,000

-

-

-

$0.227

EBV Elektronik

Germany . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TME

Poland . 2,488 parts In-Stock

1+ parts

$0.550

100+ parts

$0.300

1k+ parts

$0.267

10k+ parts

$0.255

2,488

$0.550

$0.300

$0.267

$0.255

Digiode

USA . 2,037 parts In-Stock

1+ parts

$0.656

100+ parts

-

1k+ parts

-

10k+ parts

-

2,037

$0.656

-

-

-

Flip Electronics

USA . 22,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

22,500

-

-

-

-

NAC Semi

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.786

2,500

-

-

-

$0.786

LIBRA Elektronik GmbH

Germany . 2,481 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,481

-

-

-

-

ComSIT Distribution GmbH

Germany . 258 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

258

-

-

-

-

Vyrian

USA . 65 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

65

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 366 parts In-Stock

1+ parts

$0.227

100+ parts

-

1k+ parts

-

10k+ parts

-

366

$0.227

-

-

-

Corphita

USA . 1,156 parts In-Stock

1+ parts

$0.621

100+ parts

-

1k+ parts

-

10k+ parts

-

1,156

$0.621

-

-

-

Component Stockers USA

USA . 3,258 parts In-Stock

1+ parts

$0.640

100+ parts

$0.300

1k+ parts

$0.230

10k+ parts

-

3,258

$0.640

$0.300

$0.230

-

Microchip USA

USA . 3,462 parts In-Stock

1+ parts

$1.600

100+ parts

-

1k+ parts

-

10k+ parts

-

3,462

$1.600

-

-

-

AZTECH Wire

Italy . 65 parts In-Stock

1+ parts

$18.920

100+ parts

-

1k+ parts

-

10k+ parts

-

65

$18.920

-

-

-

Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$25.618

100+ parts

$23.312

1k+ parts

$21.007

10k+ parts

-

2,000

$25.618

$23.312

$21.007

-

Perfect Parts

USA . 25,222 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

25,222

-

-

-

-

Lixinc

USA . 17,209 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

17,209

-

-

-

-

Kepictronics

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

Kulean Microsystems

USA . 4,935 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,935

-

-

-

-

TANS Electronics

Latvia . 4,353 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,353

-

-

-

-

SupplyDigital Components

Austria . 2,992 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,992

-

-

-

-

Eastek

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

-

-

-

-

GreenTree Electronics

Israel . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

-

-

-

-

UHIMA Technologies

Türkiye . 703 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

703

-

-

-

-

Problanco Electronics

Mexico . 288 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

288

-

-

-

-

Overview

Discover the ultimate solution for your multiplexing and demultiplexing needs with the MC14512BDR2G by Onsemi. Crafted with precision and expertise, this high-quality product offers unparalleled performance and reliability. Ideal for a wide range of applications, this versatile device provides seamless integration and functionality, delivering value and efficiency to customers. Trust Onsemi's reputation for excellence and elevate your projects with the MC14512BDR2G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides a good balance of durability and cost-effectiveness.

Propagation Delay At Nominal Supply: 650 ns

With a propagation delay of 650 ns at nominal supply, this multiplexer/demultiplexer offers efficient signal processing capabilities.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation of the multiplexer/demultiplexer on circuit boards.

No. of Inputs: 8

Having 8 inputs provides flexibility and accommodates a variety of input signals in the multiplexing/demultiplexing process.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources.

Load Capacitance (CL): 50 pF

The load capacitance of 50 pF allows for efficient handling of capacitance requirements in the circuit.

Power Supplies (V): 5/15

Supporting power supplies of 5V and 15V provides flexibility for different power requirements in the system.

No. of Terminals: 16

Having 16 terminals enables easy connectivity with other components in the circuit.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board and allows for denser packing of components.

Maximum Operating Temperature: 125 °C

Operating at a maximum temperature of 125°C ensures reliable performance even in high-temperature environments.

Output Characteristics: 3-STATE

The 3-STATE output characteristics provide additional flexibility in controlling the output signals.

Minimum Operating Temperature: -55 °C

The ability to operate at a minimum temperature of -55°C ensures reliable performance in low-temperature conditions.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good conductivity and solderability for reliable connections.

Terminal Position: DUAL

The dual terminal position allows for easy and secure mounting of the multiplexer/demultiplexer on the circuit board.

Maximum Seated Height: 1.75 mm

The maximum seated height of 1.75 mm ensures a compact and space-saving design for the component.

Width: 3.9 mm

The narrow width of 3.9 mm allows for efficient use of space on the circuit board.

Output Polarity: TRUE

The true output polarity ensures accurate signal processing and compatibility with other components in the system.

Minimum Supply Voltage (Vsup): 3 V

Supporting a minimum supply voltage of 3V ensures flexibility in power source options for the component.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, the component can withstand reflow soldering processes without compromising performance.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for reliable soldering and assembly of the component on the circuit board.

Length: 9.9 mm

The compact length of 9.9 mm contributes to a space-saving design and efficient use of board space.

Temperature Grade: MILITARY

The military-grade temperature rating ensures reliable performance in harsh environmental conditions and demanding applications.

Technology: CMOS

The CMOS technology used in the component offers low power consumption and high noise immunity for efficient signal processing.

Terminal Form: GULL WING

The gull-wing terminal form provides secure mounting and easy soldering of the component on the circuit board.

Packing Method: TR

The TR packing method ensures safe and secure transportation and storage of the component before installation.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27 mm allows for easy and precise connection with other components on the circuit board.

Maximum Supply Voltage (Vsup): 18 V

Supporting a maximum supply voltage of 18V ensures compatibility with a wide range of power sources and operating conditions.

Technical Specifications

Multiplexer & Demultiplexer MC14512BDR2G attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

650 ns

Propagation Delay (tpd):

650 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC14512BDR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 14