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MC14069UBDG

Onsemi

MC14069UBDG by Onsemi

MC14069UBDG by Onsemi is a CMOS Logic Gates IC with 6 functions. It operates at 5V, has a propagation delay of 125ns, and can withstand temperatures from -55 to 125°C. Ideal for military-grade applications requiring fast signal processing in compact spaces.

Median Price

$0.260

Lifecycle Status

Suppliers In-Stock

30

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 1,540 parts In-Stock

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$0.338

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$0.338

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Mouser Electronics

USA . 870 parts In-Stock

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$0.350

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$0.206

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$0.181

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$0.164

870

$0.350

$0.206

$0.181

$0.164

DigiKey

USA . 1,613 parts In-Stock

1+ parts

$0.420

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$0.242

1k+ parts

$0.200

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$0.179

1,613

$0.420

$0.242

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$0.179

Newark

USA . 765 parts In-Stock

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$0.433

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$0.216

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$0.198

765

$0.433

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$0.198

Rochester

USA . 41,374 parts In-Stock

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$0.215

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$0.178

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Verical

USA . 10,235 parts In-Stock

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Future Electronics

Canada . 3,942 parts In-Stock

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$0.113

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$0.108

3,942

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$0.108

Farnell

UK . 995 parts In-Stock

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$0.170

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$0.147

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$0.138

995

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$0.138

Element14

Singapore . 965 parts In-Stock

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$0.258

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$0.238

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$0.229

965

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$0.229

EBV Elektronik

Germany . 770 parts In-Stock

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770

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Chip1Stop

Japan . 340 parts In-Stock

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$0.262

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$0.243

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$0.237

340

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Distributors (In-Stock)

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Digiode

USA . 85 parts In-Stock

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$0.167

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85

$0.167

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TME

Poland . 107 parts In-Stock

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$0.680

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$0.365

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107

$0.680

$0.365

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Flip Electronics

USA . 15,637 parts In-Stock

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Vyrian

USA . 7,986 parts In-Stock

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Chip Stock

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IBS Electronics

USA . 3,942 parts In-Stock

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$0.165

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$0.167

3,942

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$0.167

NAC Semi

USA . 3,135 parts In-Stock

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$0.228

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$0.207

3,135

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$0.207

Sensible Micro Corp

USA . 2,216 parts In-Stock

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$0.194

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$0.180

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2,216

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$0.194

$0.180

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Pegasus Components GmbH

Germany . 375 parts In-Stock

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Lighthouse Electronics, Inc.

USA . 64 parts In-Stock

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Inventory MP

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Bristol Electronics

USA . 55 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 50 parts In-Stock

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Ashlea Components Ltd

UK . 50 parts In-Stock

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LWI Electronics Inc

India . 45 parts In-Stock

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Manotoh

Italy . 38 parts In-Stock

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Lantek

USA . 14 parts In-Stock

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Sunrise Surplus Inc.

USA . 7 parts In-Stock

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Speed Components Ltd

Israel . 5 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,380 parts In-Stock

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$0.158

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Corohmni

South Africa . 255 parts In-Stock

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$0.176

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Component Stockers USA

USA . 82,499 parts In-Stock

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$0.270

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$0.190

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$0.170

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$0.230

82,499

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$0.190

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$0.230

Continental Prestige Electronics

USA . 1,806 parts In-Stock

1+ parts

$0.571

100+ parts

$0.393

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$0.273

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$0.216

1,806

$0.571

$0.393

$0.273

$0.216

Benley Electronics

USA . 1 parts In-Stock

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$1.000

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1

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Microchip USA

USA . 5,441 parts In-Stock

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$4.940

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Perfect Parts

USA . 22,449 parts In-Stock

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Kepictronics

USA . 10,865 parts In-Stock

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TANS Electronics

Latvia . 8,011 parts In-Stock

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Kulean Microsystems

USA . 7,757 parts In-Stock

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GreenTree Electronics

Israel . 3,850 parts In-Stock

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Eastek

USA . 3,740 parts In-Stock

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Standard Data Resources (Excess)

USA . 2,500 parts In-Stock

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Problanco Electronics

Mexico . 2,469 parts In-Stock

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SupplyDigital Components

Austria . 1,305 parts In-Stock

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Infinite Electronics LLP (Excess)

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UHIMA Technologies

Türkiye . 230 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 208 parts In-Stock

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Assy Fe

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Overview

Unlock the potential of your electronic designs with the MC14069UBDG by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-quality logic gates that are essential for a wide range of applications. With a compact design and fast propagation delay, this product offers unparalleled performance and reliability. Whether you're working on consumer electronics, telecommunications, or industrial automation, the MC14069UBDG provides the value, benefits, and advantages that customers need to succeed. Trust Onsemi to elevate your projects to the next level with this cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the product durable and resistant to external impacts.

Propagation Delay at Nominal Supply: 125 ns

The low propagation delay at nominal supply ensures fast processing speed and efficient operation.

Surface Mount: YES

Being surface mount enables easy installation and space-saving on circuit boards.

Nominal Supply Voltage / Vsup: 5V

Operates at a standard 5V supply voltage commonly used in electronic systems.

Maximum Operating Temperature: 125°C

Capable of operating at high temperatures, suitable for various industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient performance.

Technical Specifications

Logic Gates MC14069UBDG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

125 ns

Propagation Delay (tpd):

125 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC14069UBDG Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-656-0450, 5962016560450

NIIN

016560450

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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