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MC14012BCPG

Onsemi

MC14012BCPG by Onsemi

MC14012BCPG by Onsemi is a CMOS Logic Gates IC with 2 functions and 4 inputs. It operates at a supply voltage of 5V, has a propagation delay of 300ns, and can withstand temperatures from -55 to 125 °C. Ideal for military-grade applications requiring high-speed logic operations.

Median Price

$39.925

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 450 parts In-Stock

1+ parts

$39.925

100+ parts

$36.332

1k+ parts

$32.738

10k+ parts

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450

$39.925

$36.332

$32.738

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Distributors (In-Stock)

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Bristol Electronics

USA . 2,025 parts In-Stock

1+ parts

$0.825

100+ parts

$0.330

1k+ parts

$0.231

10k+ parts

$0.214

2,025

$0.825

$0.330

$0.231

$0.214

Digiode

USA . 831 parts In-Stock

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$37.929

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831

$37.929

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Zilex Electronics Inc.

Canada . 11,025 parts In-Stock

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Vyrian

USA . 10,761 parts In-Stock

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Velocity Electronics

USA . 2,560 parts In-Stock

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North Shore Components

USA . 2,518 parts In-Stock

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Microfarads

USA . 1,890 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 125 parts In-Stock

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ComSIT Distribution GmbH

Germany . 49 parts In-Stock

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Dan-Mar Components

USA . 25 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 4 parts In-Stock

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AZTECH Wire

Italy . 1,091 parts In-Stock

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$16.180

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Corphita

USA . 2,344 parts In-Stock

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$35.932

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2,344

$35.932

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Advanced Electronics

New Zealand . 450 parts In-Stock

1+ parts

$39.925

100+ parts

$36.332

1k+ parts

$32.738

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450

$39.925

$36.332

$32.738

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Corohmni

South Africa . 194 parts In-Stock

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$39.925

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194

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Component Stockers USA

USA . 742 parts In-Stock

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$99.990

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742

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QUARKTWIN TECHNOLOGY LTD

USA . 18,974 parts In-Stock

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SupplyDigital Components

Austria . 4,267 parts In-Stock

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Microchip USA

USA . 3,289 parts In-Stock

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Kulean Microsystems

USA . 2,325 parts In-Stock

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Problanco Electronics

Mexico . 2,078 parts In-Stock

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TANS Electronics

Latvia . 1,824 parts In-Stock

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UHIMA Technologies

Türkiye . 202 parts In-Stock

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FE SAS

France . 75 parts In-Stock

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Assy Fe

Spain . 60 parts In-Stock

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Ashlea Components Ltd (Excess)

UK . 28 parts In-Stock

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Overview

Discover the top-quality MC14012BCPG Logic Gates from Onsemi, designed to deliver reliable performance and precision in a variety of applications. With 2 functions and 4 inputs, this product offers exceptional value with a propagation delay of just 300 ns, making it ideal for fast-paced environments. Whether you're looking to streamline operations or enhance functionality, the MC14012BCPG is the perfect solution for your needs. Upgrade your systems today and experience the difference with Onsemi's advanced technology and superior craftsmanship.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and protection for the internal components of the logic gates.

Propagation Delay At Nominal Supply: 300 ns

The fast propagation delay helps in quick signal processing and efficient operation of the logic gates.

No. of Functions: 2

Having multiple functions in a single device increases versatility and functionality.

No. of Inputs: 4

With 4 inputs, the logic gates can handle multiple input signals simultaneously.

Nominal Supply Voltage / Vsup (V): 5

Operational at a standard voltage of 5V, making it compatible with common electronic systems.

Load Capacitance (CL): 50 pF

The low load capacitance ensures efficient performance and minimal power consumption.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology provides low power consumption and high noise immunity.

Maximum Operating Temperature: 125 °C

The high operating temperature range allows the logic gates to withstand harsh environmental conditions.

Minimum Operating Temperature: -55 °C

The wide temperature range ensures reliable operation in extreme cold conditions.

Maximum Supply Voltage (Vsup): 18 V

Ability to handle high supply voltages makes these logic gates suitable for a variety of applications.

Technical Specifications

Logic Gates MC14012BCPG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e3

Length:

18.86 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

2

No. of Inputs:

4

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

300 ns

Propagation Delay (tpd):

300 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

4.69 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.62 mm

Trade Compliance

MC14012BCPG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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