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MC10H161FNR2

Onsemi

MC10H161FNR2 by Onsemi

MC10H161FNR2 by Onsemi is a 20-terminal ECL chip carrier with 2.1ns propagation delay, suitable for commercial extended temperature applications. It features inverted output polarity, open-emitter characteristics, and operates at a max supply current of 84mA.

Median Price

$3.476

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

$3.090

1k+ parts

$2.760

10k+ parts

$2.600

2,500

-

$3.090

$2.760

$2.600

Verical

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

$3.862

1k+ parts

$3.450

10k+ parts

-

2,500

-

$3.862

$3.450

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,140 parts In-Stock

1+ parts

$2.840

100+ parts

-

1k+ parts

-

10k+ parts

-

1,140

$2.840

-

-

-

Digiode

USA . 1,188 parts In-Stock

1+ parts

$3.278

100+ parts

-

1k+ parts

-

10k+ parts

-

1,188

$3.278

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 258 parts In-Stock

1+ parts

$2.840

100+ parts

-

1k+ parts

-

10k+ parts

-

258

$2.840

-

-

-

Corphita

USA . 1,225 parts In-Stock

1+ parts

$3.105

100+ parts

-

1k+ parts

-

10k+ parts

-

1,225

$3.105

-

-

-

Kulean Microsystems

USA . 7,792 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,792

-

-

-

-

Problanco Electronics

Mexico . 6,016 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,016

-

-

-

-

TANS Electronics

Latvia . 3,765 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,765

-

-

-

-

Continental Prestige Electronics

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

$2.980

1k+ parts

-

10k+ parts

-

2,500

-

$2.980

-

-

SupplyDigital Components

Austria . 1,599 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,599

-

-

-

-

UHIMA Technologies

Türkiye . 881 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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881

-

-

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Microchip USA

USA . 140 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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10k+ parts

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140

-

-

-

-

Overview

Experience superior performance and reliability with the MC10H161FNR2 by Onsemi. As a leader in the semiconductor industry, Onsemi delivers top-notch quality products that exceed customer expectations. This decoder and driver is perfect for a wide range of applications, offering fast propagation delay and open-emitter output characteristics. With its advanced technology and commercial extended temperature grade, this product ensures optimal functionality in diverse settings. Trust Onsemi to provide you with the best solutions for your decoding and driving needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the components inside, ensuring long-lasting performance.

Propagation Delay At Nominal Supply: 2.2 ns

Fast propagation delay allows for quick processing and response times, making this decoder & driver efficient.

Surface Mount: YES

Easy installation and space-saving design.

Package Shape: SQUARE

Compact shape that can fit easily in various applications.

Output Characteristics: OPEN-EMITTER

Provides flexibility in connecting to different types of circuits.

Technical Specifications

Decoder & Drivers MC10H161FNR2 attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Family:

10H

Input Conditioning:

STANDARD

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e0

Length:

8.965 mm

Logic IC Type:

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TR

Peak Reflow Temperature (C):

235

Maximum Power Supply Current (ICC):

84 mA

Propagation Delay At Nominal Supply:

2.2 ns

Propagation Delay (tpd):

2.1 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Decoder/Drivers

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.965 mm

Trade Compliance

MC10H161FNR2 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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