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MC10161FN

Onsemi

MC10161FN by Onsemi

MC10161FN by Onsemi is a 20-terminal decoder with 6.4ns propagation delay, -5.2V power supply, and ECL technology. It has a chip carrier package style and operates b/w -30 to 85 °C. Ideal for applications requiring fast signal decoding in compact spaces.

Median Price

$3.112

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,978 parts In-Stock

1+ parts

-

100+ parts

$2.780

1k+ parts

$2.490

10k+ parts

$2.340

3,978

-

$2.780

$2.490

$2.340

DigiKey

USA . 3,978 parts In-Stock

1+ parts

-

100+ parts

$3.660

1k+ parts

-

10k+ parts

-

3,978

-

$3.660

-

-

Verical

USA . 2,103 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.112

10k+ parts

$2.925

2,103

-

-

$3.112

$2.925

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 396 parts In-Stock

1+ parts

$2.945

100+ parts

-

1k+ parts

-

10k+ parts

-

396

$2.945

-

-

-

Vyrian

USA . 1,715 parts In-Stock

1+ parts

$3.100

100+ parts

-

1k+ parts

-

10k+ parts

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1,715

$3.100

-

-

-

Q Components

USA . 45 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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45

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 277 parts In-Stock

1+ parts

$2.790

100+ parts

-

1k+ parts

-

10k+ parts

-

277

$2.790

-

-

-

Corohmni

South Africa . 142 parts In-Stock

1+ parts

$3.100

100+ parts

-

1k+ parts

-

10k+ parts

-

142

$3.100

-

-

-

Kulean Microsystems

USA . 8,338 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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8,338

-

-

-

-

Kepictronics

USA . 4,478 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,478

-

-

-

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Continental Prestige Electronics

USA . 3,978 parts In-Stock

1+ parts

-

100+ parts

$2.550

1k+ parts

-

10k+ parts

-

3,978

-

$2.550

-

-

TANS Electronics

Latvia . 2,700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,700

-

-

-

-

Problanco Electronics

Mexico . 2,236 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,236

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-

-

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UHIMA Technologies

Türkiye . 509 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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509

-

-

-

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SupplyDigital Components

Austria . 133 parts In-Stock

1+ parts

-

100+ parts

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133

-

-

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-

Overview

Elevate your electronics with the MC10161FN by Onsemi, a premium Decoder & Drivers device that delivers top-notch performance and reliability. Manufactured by industry leader Onsemi, this product boasts high-quality materials and cutting-edge technology, making it ideal for a wide range of applications. With fast propagation delay and standard input conditioning, the MC10161FN offers unparalleled value and benefits to customers seeking a dependable solution for their projects. Upgrade your electronics with the MC10161FN and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and reliable, ensuring the product is long-lasting.

Propagation Delay At Nominal Supply: 6.4 ns

Fast propagation delay ensures quick response times in decoding and driving signals.

Surface Mount: YES

Enables easy installation and space-saving on PCBs.

Input Conditioning: STANDARD

Standard input conditioning ensures compatibility with various signal sources.

Output Characteristics: OPEN-EMITTER

Open-emitter output allows for flexible connection configurations.

Technology: ECL

ECL technology offers high-speed performance and low power consumption.

Technical Specifications

Decoder & Drivers MC10161FN attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Family:

10K

Input Conditioning:

STANDARD

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e0

Length:

8.965 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

235

Power Supplies (V):

-5.2

Maximum Power Supply Current (ICC):

84 mA

Propagation Delay At Nominal Supply:

6.4 ns

Propagation Delay (tpd):

6 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Decoder/Drivers

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.965 mm

Trade Compliance

MC10161FN Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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