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MC10161L

Onsemi

MC10161L by Onsemi

MC10161L by Onsemi is a 16-terminal ECL decoder with 6.4 ns propagation delay and -5.2V power supply. Ideal for applications requiring fast signal decoding, it features open-emitter output and operates b/w -30 to 85°C temperatures.

Median Price

$3.938

Lifecycle Status

Suppliers In-Stock

27

In-Stock Inventory

1k+

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Rochester

USA . 1,090 parts In-Stock

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$2.990

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$2.680

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$2.520

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DigiKey

USA . 1,090 parts In-Stock

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$3.940

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Verical

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$3.938

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$3.350

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$3.150

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$3.150

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TEDSS.com

USA . 150 parts In-Stock

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Digiode

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Vyrian

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American Microsemiconductor Inc.

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Electronic Expediters

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LWI Electronics Inc

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M&R Communications

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Classic Components Corporation

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Electronics Depot

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ECAB

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Sogenti Electronics

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ComSIT Distribution GmbH

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Standard Data Resources

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Prism Electronics

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Corohmni

South Africa . 82 parts In-Stock

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Corphita

USA . 1,296 parts In-Stock

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TANS Electronics

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Metaverse IC Inc.

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QUARKTWIN TECHNOLOGY LTD

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SupplyDigital Components

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Continental Prestige Electronics

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Kepictronics

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Problanco Electronics

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UHIMA Technologies

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Kulean Microsystems

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Overview

Unlock the power of precision with the MC10161L by Onsemi, a top-tier manufacturer known for delivering superior quality products. This decoder and driver offers lightning-fast propagation delay, ensuring optimal performance in various applications. With a focus on reliability and efficiency, this product guarantees seamless operation and unmatched value for customers seeking top-notch solutions. Upgrade your projects with the MC10161L and experience unparalleled benefits that will take your designs to the next level.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides durability and protection, making the product suitable for various environments.

Propagation Delay At Nominal Supply: 6.4 ns

Low propagation delay ensures fast response times, making this product efficient for time-sensitive applications.

Input Conditioning: STANDARD

Standard input conditioning simplifies integration and compatibility with other components.

Output Characteristics: OPEN-EMITTER

Open-emitter output allows for flexibility in connecting external components, enhancing the product's versatility.

Technology: ECL

ECL technology provides high-speed performance and low power consumption, making this product suitable for demanding applications.

Technical Specifications

Decoder & Drivers MC10161L attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Family:

10K

Input Conditioning:

STANDARD

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.49 mm

Logic IC Type:

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

-5.2

Maximum Power Supply Current (ICC):

84 mA

Propagation Delay At Nominal Supply:

6.4 ns

Propagation Delay (tpd):

6 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Decoder/Drivers

Surface Mount:

NO

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

MC10161L Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-076-5905, 5962010765905

NIIN

010765905

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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