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MC10H161FNR2G

Onsemi

MC10H161FNR2G by Onsemi

MC10H161FNR2G by Onsemi is a 20-terminal ECL chip carrier with 2.1 ns propagation delay and 84 mA ICC. It operates b/w 0-75 °C, has inverted output polarity, and is ideal for decoder & driver applications requiring fast signal processing in commercial extended temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,754 parts In-Stock

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Digiode

USA . 70 parts In-Stock

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70

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Ampacity Inc.

Singapore . 624 parts In-Stock

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$60.000

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624

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Kulean Microsystems

USA . 6,303 parts In-Stock

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SupplyDigital Components

Austria . 5,162 parts In-Stock

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Problanco Electronics

Mexico . 4,850 parts In-Stock

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TANS Electronics

Latvia . 3,592 parts In-Stock

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Corphita

USA . 2,197 parts In-Stock

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Corohmni

South Africa . 435 parts In-Stock

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UHIMA Technologies

Türkiye . 314 parts In-Stock

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Microchip USA

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Overview

Experience unparalleled performance and reliability with the MC10H161FNR2G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality products that exceed expectations. The MC10H161FNR2G falls under the category of Decoder & Drivers, offering lightning-fast propagation delay at 2.2 ns and a reliable surface mount design. This versatile product is perfect for a wide range of applications, providing customers with superior value, benefits, and advantages. Trust Onsemi to provide you with the best in the business.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and ensures the safety of the internal components of the decoder & drivers, making it a reliable choice for long-term use.

Propagation Delay At Nominal Supply: 2.2 ns

The low propagation delay ensures fast and efficient operation of the decoder & drivers, making it suitable for applications where timing is critical.

Surface Mount: YES

Being surface mountable allows for easy integration into circuit boards, making installation quick and simple.

Input Conditioning: STANDARD

Standard input conditioning ensures compatibility with various input signals, making this decoder & drivers versatile and suitable for a wide range of applications.

Output Characteristics: OPEN-EMITTER

The open-emitter output allows for flexibility in connecting external components, enhancing the functionality and adaptability of the decoder & drivers.

Technical Specifications

Decoder & Drivers MC10H161FNR2G attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Family:

10H

Input Conditioning:

STANDARD

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e3

Length:

8.965 mm

Logic IC Type:

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

84 mA

Propagation Delay At Nominal Supply:

2.2 ns

Propagation Delay (tpd):

2.1 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Decoder/Drivers

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.965 mm

Trade Compliance

MC10H161FNR2G Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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