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MC10172FN

Onsemi

MC10172FN by Onsemi

MC10172FN by Onsemi is a 20-terminal decoder with 6ns propagation delay. It operates b/w -30 °C to 85°C, suitable for ECL technology applications. The chip carrier package style and open-emitter output make it ideal for high-speed signal decoding tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,417 parts In-Stock

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Vyrian

USA . 66 parts In-Stock

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66

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Kulean Microsystems

USA . 5,239 parts In-Stock

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5,239

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Problanco Electronics

Mexico . 3,789 parts In-Stock

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Corphita

USA . 1,926 parts In-Stock

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SupplyDigital Components

Austria . 1,311 parts In-Stock

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TANS Electronics

Latvia . 855 parts In-Stock

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855

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UHIMA Technologies

Türkiye . 315 parts In-Stock

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315

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Corohmni

South Africa . 78 parts In-Stock

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Overview

Unlock the potential of your electronic devices with the MC10172FN by Onsemi. This high-quality decoder & driver offers unmatched precision and reliability, making it ideal for a wide range of applications. With its innovative design and advanced technology, this product provides customers with superior performance and value. Trust Onsemi to deliver the best in semiconductor solutions, and experience the benefits of cutting-edge technology with the MC10172FN.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, suitable for various applications.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation on PCBs, saving space and improving overall design flexibility.

No. of Functions: 2

Having 2 functions in a single component streamlines the circuit design and reduces the need for additional components, making it cost-effective.

Package Shape: SQUARE

The square package shape ensures easy placement and alignment on the circuit board, improving overall assembly efficiency.

No. of Terminals: 20

With a sufficient number of terminals, this decoder & driver component can accommodate multiple connections and signals, enhancing its versatility.

Package Style (Meter): CHIP CARRIER

The chip carrier style provides a compact form factor, ideal for space-constrained applications where size matters.

Propagation Delay (tpd): 6 ns

The low propagation delay of 6 ns ensures fast signal processing and response times, critical for high-speed applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C makes this decoder & driver suitable for a wide range of environments and conditions.

Output Characteristics: OPEN-EMITTER

The open-emitter output characteristics allow for flexible connection options and compatibility with various types of loads.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature of -30 °C ensures the reliable performance of this component even in harsh cold environments.

Terminal Finish: TIN LEAD

The tin lead terminal finish offers good solderability and conductivity, ensuring reliable connections and signal transmission.

Terminal Position: QUAD

The quad terminal position allows for easy and secure mounting on the PCB, enhancing stability and reliability.

Maximum Seated Height: 4.57 mm

The maximum seated height of 4.57 mm ensures compatibility with various PCB layouts and designs, accommodating different space constraints.

Width: 8.965 mm

The compact width of 8.965 mm saves space on the PCB, making it easier to integrate this decoder & driver into tight layouts.

Output Polarity: TRUE

The true output polarity simplifies the design and compatibility with other components, reducing the chances of errors in signal interpretation.

Length: 8.965 mm

The short length of 8.965 mm ensures a compact overall footprint, ideal for applications where size and space are critical factors.

Technology: ECL

The ECL technology offers high-speed operation and low power consumption, making this decoder & driver efficient and reliable for demanding applications.

Terminal Form: J BEND

The J bend terminal form provides strong mechanical stability and easy soldering, ensuring secure connections and long-term performance.

Terminal Pitch: 1.27 mm

The narrow terminal pitch of 1.27 mm allows for high-density mounting on the PCB, maximizing space utilization and enhancing circuit design flexibility.

Technical Specifications

Decoder & Drivers MC10172FN attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Family:

10K

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e0

Length:

8.965 mm

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Propagation Delay (tpd):

6 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.965 mm

Trade Compliance

MC10172FN Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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