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MC10162L

Onsemi

MC10162L by Onsemi

MC10162L by Onsemi is a 16-terminal ECL decoder with 6.4 ns propagation delay and -5.2V power supply. It features open-emitter output polarity, suitable for applications requiring fast signal decoding in temperature range of -30 to 85 °C.

Median Price

$3.950

Lifecycle Status

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1k+

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Rochester

USA . 334 parts In-Stock

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$3.160

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$2.830

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$2.660

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DigiKey

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Verical

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$3.950

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$3.538

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$3.325

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Freelance Electronics

USA . 10 parts In-Stock

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Digiode

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Component Electronics Inc.

Canada . 2 parts In-Stock

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Bristol Electronics

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Forefront Electronics and Design

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Vyrian

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DigiKey Marketplace

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Resion

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Corohmni

South Africa . 440 parts In-Stock

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Corphita

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RC Electronics

USA . 14,971 parts In-Stock

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Overview

Enhance your electronic designs with the MC10162L decoder & driver from Onsemi. Known for their high-quality components, Onsemi delivers reliable solutions for a wide range of applications. The MC10162L offers fast propagation delay at just 6.4 ns, ensuring efficient performance. With its inverted output polarity and open-emitter characteristics, this product provides versatility and flexibility in your projects. Experience the benefits of Onsemi's cutting-edge technology and unlock new possibilities for your designs with the MC10162L.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Ceramic and glass-sealed packages provide excellent protection for the internal components of the decoder & driver, enhancing its durability and reliability.

Propagation Delay At Nominal Supply: 6.4 ns

Low propagation delay ensures fast processing of signals, making this decoder & driver suitable for high-speed applications where quick response times are crucial.

Input Conditioning: STANDARD

Standard input conditioning simplifies the integration of this decoder & driver into various circuit designs, offering compatibility with a wide range of systems.

Output Characteristics: OPEN-EMITTER

Open-emitter output characteristics allow for flexibility in connecting external components, enabling customization of the output signal according to specific requirements.

Technology: ECL

ECL (Emitter-Coupled Logic) technology offers high-speed operation and low power consumption, making this decoder & driver an efficient choice for demanding applications.

Technical Specifications

Decoder & Drivers MC10162L attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Family:

10K

Input Conditioning:

STANDARD

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.49 mm

Logic IC Type:

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

-5.2

Maximum Power Supply Current (ICC):

84 mA

Propagation Delay At Nominal Supply:

6.4 ns

Propagation Delay (tpd):

6 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Decoder/Drivers

Surface Mount:

NO

Technology:

ECL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

MC10162L Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-014-9637, 5962010149637, 5962-01-107-5037, 5962011075037

NIIN

010149637, 011075037

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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