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MC10162FN

Onsemi

MC10162FN by Onsemi

MC10162FN by Onsemi is a 20-terminal decoder with 6.4ns propagation delay, -5.2V power supply, and ECL technology. It is used in applications requiring fast signal decoding and inverted output polarity, suitable for operating temperatures b/w -30 to 85 °C.

Median Price

$2.940

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 45 parts In-Stock

1+ parts

-

100+ parts

$2.940

1k+ parts

$2.630

10k+ parts

$2.470

45

-

$2.940

$2.630

$2.470

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 116 parts In-Stock

1+ parts

$3.097

100+ parts

-

1k+ parts

-

10k+ parts

-

116

$3.097

-

-

-

Vyrian

USA . 2,558 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,558

-

-

-

-

EMSNET

USA . 31 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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31

-

-

-

-

Q Components

USA . 18 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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18

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,256 parts In-Stock

1+ parts

$2.934

100+ parts

-

1k+ parts

-

10k+ parts

-

2,256

$2.934

-

-

-

Corohmni

South Africa . 153 parts In-Stock

1+ parts

$3.260

100+ parts

-

1k+ parts

-

10k+ parts

-

153

$3.260

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 9,754 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

9,754

-

-

-

-

TANS Electronics

Latvia . 7,128 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,128

-

-

-

-

Kulean Microsystems

USA . 5,707 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,707

-

-

-

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SupplyDigital Components

Austria . 5,643 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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5,643

-

-

-

-

Microchip USA

USA . 2,942 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,942

-

-

-

-

Problanco Electronics

Mexico . 2,256 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,256

-

-

-

-

Kepictronics

USA . 800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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800

-

-

-

-

UHIMA Technologies

Türkiye . 790 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

-

790

-

-

-

-

Overview

Experience the superior quality and reliability of the MC10162FN by Onsemi, a leading manufacturer in the industry. This decoder & driver chip offers unparalleled performance and precision, making it ideal for a wide range of applications. From automotive to industrial automation, this versatile product delivers exceptional value and benefits to customers. Trust Onsemi for innovative solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the decoder & drivers, making it a reliable choice for long-term use.

Propagation Delay At Nominal Supply: 6.4 ns

The low propagation delay ensures quick signal processing, making the decoder & drivers efficient in transferring data accurately and quickly.

Surface Mount: YES

Being surface mountable allows for easy and seamless integration with other components on a circuit board, simplifying the assembly process.

Input Conditioning: STANDARD

The standard input conditioning ensures compatibility with a wide range of input signals, making it versatile for various applications.

Package Shape: SQUARE

The square package shape is common and easy to work with, fitting well in most circuit designs.

Power Supplies (V): -5.2

The negative power supply voltage allows for flexibility in system design and operation, catering to specific power requirements.

No. of Terminals: 20

Having a sufficient number of terminals enables connectivity with multiple external components, expanding the functionality of the decoder & drivers.

Package Style (Meter): CHIP CARRIER

The chip carrier package style provides a compact and efficient form factor, ideal for space-constrained applications.

Output Characteristics: OPEN-EMITTER

The open-emitter output allows for easy interfacing with other devices, enhancing compatibility and integration capabilities.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in extreme environmental conditions, making it suitable for a wide range of applications.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature allows for operation in cold environments without loss of performance, providing versatility in usage.

Terminal Finish: TIN LEAD

The tin lead terminal finish offers good solderability and conductivity, ensuring secure connections for robust performance.

Terminal Position: QUAD

The quad terminal position provides stability and ease of soldering during installation, enhancing the reliability and longevity of the decoder & drivers.

Maximum Seated Height: 4.57 mm

The low maximum seated height enables the decoder & drivers to be used in compact devices or designs where space is limited.

Width: 8.965 mm

The moderate width of the decoder & drivers allows for easy placement on a circuit board without occupying excessive space.

Output Polarity: INVERTED

The inverted output polarity provides compatibility with systems requiring inverted signals, expanding the range of applications where the decoder & drivers can be used.

Peak Reflow Temperature °C: 235

The high peak reflow temperature ensures reliable soldering during assembly processes, reducing the risk of solder joint failures.

Length: 8.965 mm

The moderate length of the decoder & drivers complements its width, offering a balanced form factor for easy integration into circuit layouts.

Technology: ECL

Using ECL technology allows for high-speed operation, making the decoder & drivers suitable for applications requiring rapid signal processing and data transfer.

Terminal Form: J BEND

The J bend terminal form simplifies the soldering process and provides mechanical stability, ensuring secure connections for reliable performance.

Terminal Pitch: 1.27 mm

The standard terminal pitch facilitates easy connection to external components or a circuit board, enhancing the versatility and compatibility of the decoder & drivers.

Maximum Power Supply Current (ICC): 84 mA

The maximum power supply current rating ensures sufficient power for the decoder & drivers to operate reliably under specified conditions, supporting continuous performance.

Technical Specifications

Decoder & Drivers MC10162FN attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Family:

10K

Input Conditioning:

STANDARD

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e0

Length:

8.965 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

235

Power Supplies (V):

-5.2

Maximum Power Supply Current (ICC):

84 mA

Propagation Delay At Nominal Supply:

6.4 ns

Propagation Delay (tpd):

6 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Decoder/Drivers

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.965 mm

Trade Compliance

MC10162FN Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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