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MC10172L

Onsemi

MC10172L by Onsemi

MC10172L by Onsemi is a dual-function decoder with 16 terminals. It features a propagation delay of 6ns and operates b/w -30 °C to 85°C. Ideal for applications requiring open-emitter output characteristics, such as in-line package style and ECL technology designs.

Median Price

$6.480

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

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Freelance Electronics

USA . 3 parts In-Stock

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Bristol Electronics

USA . 250 parts In-Stock

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$8.960

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$3.882

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$3.674

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ECAB

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Prism Electronics

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M&R Communications

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LWI Electronics Inc

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Resion

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Corohmni

South Africa . 434 parts In-Stock

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Kulean Microsystems

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Problanco Electronics

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Overview

Unlock the potential of your electronic projects with the MC10172L by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-quality Decoder & Drivers like no other. With its ceramic, glass-sealed body and fast 6ns propagation delay, this product is perfect for applications requiring precision and reliability. Its compact design with 16 terminals ensures easy integration, while the true output polarity adds to its versatility. Trust Onsemi to provide innovative solutions that add value to your projects and take them to the next level.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material ensures that the product is durable and can withstand high temperatures, making it a reliable choice for various applications.

No. of Functions: 2

Having multiple functions in one device provides versatility and efficiency in circuit design, making this product a convenient choice for complex applications.

Propagation Delay (tpd): 6 ns

With a low propagation delay, this product ensures fast response times in signal processing, which is crucial for time-sensitive applications.

Technology: ECL

ECL technology offers high-speed performance and low power consumption, making this product ideal for applications where speed and efficiency are critical.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows this product to be used in environments with elevated temperatures without compromising performance.

Technical Specifications

Decoder & Drivers MC10172L attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Family:

10K

JESD-30 Code:

R-GDIP-T16

Length:

19.495 mm

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

6 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Surface Mount:

NO

Technology:

ECL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

MC10172L Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-223-9453, 5962012239453, 5962-01-130-2000, 5962011302000

NIIN

012239453, 011302000

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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