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MC10171FN

Onsemi

MC10171FN by Onsemi

MC10171FN by Onsemi is a Decoder & Drivers chip with 6.4ns Propagation Delay, -5.2V Power Supplies, and 85 °C Max Operating Temp. Ideal for applications requiring fast signal processing in electronic circuits with limited space constraints.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,973 parts In-Stock

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Vyrian

USA . 1,220 parts In-Stock

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A2Z Electronics, Inc.

USA . 90 parts In-Stock

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90

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EMSNET

USA . 30 parts In-Stock

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Prism Electronics

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Kulean Microsystems

USA . 7,905 parts In-Stock

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TANS Electronics

Latvia . 6,693 parts In-Stock

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Problanco Electronics

Mexico . 5,301 parts In-Stock

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Corphita

USA . 2,314 parts In-Stock

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SupplyDigital Components

Austria . 926 parts In-Stock

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Kepictronics

USA . 200 parts In-Stock

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Corohmni

South Africa . 140 parts In-Stock

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UHIMA Technologies

Türkiye . 50 parts In-Stock

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Overview

Discover the power of the MC10171FN by Onsemi, a high-quality decoder & driver that delivers unmatched performance and reliability. With its cutting-edge technology and innovative design, this product is ideal for a wide range of applications. From improving efficiency to enhancing functionality, this versatile device offers customers unparalleled value and benefits. Trust in Onsemi to provide you with top-notch solutions that meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable.

Propagation Delay At Nominal Supply: 6.4 ns

The low propagation delay at nominal supply ensures fast and efficient operation of the decoder and drivers.

Surface Mount: YES

Being surface mountable makes the product easy to integrate onto circuit boards, saving space and simplifying assembly.

Input Conditioning: STANDARD

Standard input conditioning ensures compatibility with a wide range of input signals.

No. of Functions: 2

Having two functions in one device increases efficiency and reduces the number of components needed in a circuit design.

Package Shape: SQUARE

The square package shape allows for easy and efficient placement on circuit boards.

Power Supplies (V): -5.2

The negative power supply voltage allows for compatibility with specific circuit requirements and designs.

No. of Terminals: 20

Having 20 terminals provides flexibility in connecting the decoder and drivers to other components in a circuit.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers good thermal performance and protection for the internal components.

Output Characteristics: OPEN-EMITTER

The open-emitter output characteristics allow for versatile connectivity options in various circuit configurations.

Minimum Operating Temperature: -30 °C

The wide operating temperature range ensures reliable performance in different environmental conditions.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good solderability and resistance to corrosion.

Width: 8.965 mm

The compact width of the product contributes to space-saving on the circuit board.

Output Polarity: INVERTED

The inverted output polarity allows for specific signal processing in the circuit design.

Technology: ECL

Using ECL technology ensures high-speed operation and low power consumption.

Technical Specifications

Decoder & Drivers MC10171FN attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Family:

10K

Input Conditioning:

STANDARD

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e0

Length:

8.965 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

235

Power Supplies (V):

-5.2

Maximum Power Supply Current (ICC):

85 mA

Propagation Delay At Nominal Supply:

6.4 ns

Propagation Delay (tpd):

6 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Decoder/Drivers

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.965 mm

Trade Compliance

MC10171FN Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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