Loading...

MC10H160FNG

Onsemi

MC10H160FNG by Onsemi

MC10H160FNG by Onsemi is a 12-bit digital arithmetic circuit with 3.3 ns propagation delay. It operates in commercial extended temperature range of 0-75 °C, suitable for high-speed applications requiring true output polarity. The chip carrier package style with quad terminals and J bend form makes it ideal for surface mount designs.

Median Price

$3.476

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,198 parts In-Stock

1+ parts

-

100+ parts

$3.090

1k+ parts

$2.760

10k+ parts

$2.600

5,198

-

$3.090

$2.760

$2.600

Verical

USA . 5,198 parts In-Stock

1+ parts

-

100+ parts

$3.862

1k+ parts

$3.450

10k+ parts

$3.250

5,198

-

$3.862

$3.450

$3.250

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,235 parts In-Stock

1+ parts

$3.278

100+ parts

-

1k+ parts

-

10k+ parts

-

1,235

$3.278

-

-

-

Vyrian

USA . 3,006 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,006

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 278 parts In-Stock

1+ parts

$2.950

100+ parts

-

1k+ parts

-

10k+ parts

-

278

$2.950

-

-

-

Corphita

USA . 1,327 parts In-Stock

1+ parts

$3.105

100+ parts

-

1k+ parts

-

10k+ parts

-

1,327

$3.105

-

-

-

AZTECH Wire

Italy . 1,012 parts In-Stock

1+ parts

$18.070

100+ parts

-

1k+ parts

-

10k+ parts

-

1,012

$18.070

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 26,734 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

26,734

-

-

-

-

Continental Prestige Electronics

USA . 5,198 parts In-Stock

1+ parts

-

100+ parts

$2.950

1k+ parts

-

10k+ parts

-

5,198

-

$2.950

-

-

TANS Electronics

Latvia . 5,171 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,171

-

-

-

-

SupplyDigital Components

Austria . 5,046 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,046

-

-

-

-

Problanco Electronics

Mexico . 1,941 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,941

-

-

-

-

Kulean Microsystems

USA . 1,566 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,566

-

-

-

-

UHIMA Technologies

Türkiye . 436 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

436

-

-

-

-

Microchip USA

USA . 412 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

412

-

-

-

-

Overview

Enhance your digital arithmetic circuits with the MC10H160FNG by Onsemi, a high-quality solution designed to bring efficiency and accuracy to your applications. Manufactured by Onsemi, a trusted leader in semiconductor technology, this innovative product offers 12 bits of precision in a compact square package, ensuring optimal performance in a variety of settings. With a fast propagation delay of 3.3 ns and a wide operating temperature range, the MC10H160FNG delivers reliable results every time. Upgrade your systems with this advanced chip carrier from Onsemi and experience the benefits of enhanced speed, precision, and reliability in your digital arithmetic circuits.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material for the package body ensures the product is rugged and suitable for a wide range of applications.

No. of Bits: 12

With 12 bits, this digital arithmetic circuit offers high precision and accuracy in calculations, making it ideal for tasks that require complex computations.

Propagation Delay (tpd): 3.3 ns

The low propagation delay of 3.3 ns ensures fast data processing and reduced latency, making this product efficient for time-sensitive applications.

Maximum Operating Temperature: 75 °C

With a maximum operating temperature of 75 °C, this digital arithmetic circuit can withstand high temperatures without compromising performance, making it suitable for industrial environments.

Technology: ECL

Employing Emitter-Coupled Logic (ECL) technology provides high-speed operation and low power consumption, making this product a reliable choice for demanding computing tasks.

Technical Specifications

Digital Arithmetic Circuits MC10H160FNG attributes and parameters. Explore more Digital Arithmetic Circuits devices from Onsemi

Specs

Family:

10H

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e3

Length:

8.965 mm

Logic IC Type:

No. of Bits:

12

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

3.3 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Arithmetic Circuits

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.965 mm

Trade Compliance

MC10H160FNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20