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MC10EP57MNG

Onsemi

MC10EP57MNG by Onsemi

MC10EP57MNG by Onsemi is a 4-input multiplexer with 0.52 ns propagation delay at 3.3V, operating b/w -40 to 85 °C. It features ECL technology, complementary output polarity, and rail packing method. Ideal for industrial applications requiring fast signal switching in tight spaces.

Median Price

$12.040

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 11 parts In-Stock

1+ parts

$13.880

100+ parts

$10.050

1k+ parts

$9.700

10k+ parts

-

11

$13.880

$10.050

$9.700

-

DigiKey

USA . 92 parts In-Stock

1+ parts

$14.310

100+ parts

$9.759

1k+ parts

-

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92

$14.310

$9.759

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-

Rochester

USA . 1,894 parts In-Stock

1+ parts

-

100+ parts

$8.160

1k+ parts

$7.300

10k+ parts

$6.870

1,894

-

$8.160

$7.300

$6.870

Verical

USA . 1,380 parts In-Stock

1+ parts

-

100+ parts

$10.200

1k+ parts

$9.125

10k+ parts

-

1,380

-

$10.200

$9.125

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 850 parts In-Stock

1+ parts

$8.636

100+ parts

-

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850

$8.636

-

-

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Vyrian

USA . 3,168 parts In-Stock

1+ parts

-

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3,168

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Flip Electronics

USA . 1,564 parts In-Stock

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1,564

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Distributors (Availability)

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Ampacity Inc.

Singapore . 673 parts In-Stock

1+ parts

$7.730

100+ parts

-

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673

$7.730

-

-

-

Corphita

USA . 1,503 parts In-Stock

1+ parts

$8.181

100+ parts

-

1k+ parts

-

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1,503

$8.181

-

-

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Corohmni

South Africa . 194 parts In-Stock

1+ parts

$9.090

100+ parts

-

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194

$9.090

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Component Stockers USA

USA . 346 parts In-Stock

1+ parts

$9.190

100+ parts

$8.640

1k+ parts

-

10k+ parts

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346

$9.190

$8.640

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Microchip USA

USA . 1,129 parts In-Stock

1+ parts

$40.768

100+ parts

-

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1,129

$40.768

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TANS Electronics

Latvia . 7,023 parts In-Stock

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7,023

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Kulean Microsystems

USA . 3,964 parts In-Stock

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3,964

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Problanco Electronics

Mexico . 1,310 parts In-Stock

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1,310

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UHIMA Technologies

Türkiye . 877 parts In-Stock

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877

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Continental Prestige Electronics

USA . 525 parts In-Stock

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525

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Authorized Procurement Solutions

USA . 184 parts In-Stock

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184

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Kepictronics

USA . 125 parts In-Stock

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SupplyDigital Components

Austria . 111 parts In-Stock

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111

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Perfect Parts

USA . 59 parts In-Stock

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59

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Overview

Unlock unparalleled performance with the MC10EP57MNG from Onsemi, a leader in innovative semiconductor solutions. This high-speed multiplexer delivers lightning-fast data processing, ensuring seamless operation in demanding applications like telecommunications and data networking. With its compact design and robust temperature range, it guarantees reliability in industrial environments. Experience the power of quality engineering and elevate your projects today!

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 0.52 ns

This low propagation delay ensures fast signal processing, making the device suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for compact designs and reduces circuit board space usage, facilitating easier assembly.

Number of Inputs: 4

With 4 inputs, this product offers versatility for various signal multiplexing applications, enhancing functionality.

Package Shape: SQUARE

The square package facilitates efficient PCB layout and optimizes space utilization on the board.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V makes it compatible with modern low-voltage digital systems.

Power Supplies (V): -5.2

The ability to support a negative power supply enhances performance for specific ECL applications requiring such configurations.

Number of Terminals: 20

With 20 terminals, this part provides ample connectivity options for complex circuit designs.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile and heat sink ability ensure effective heat dissipation while optimizing space in the final product.

Propagation Delay (tpd): 0.475 ns

A slightly lower propagation delay guarantees even faster performance, vital for high-frequency applications.

Maximum Operating Temperature: 85 °C

This high maximum operating temperature makes it reliable for industrial and extreme environmental applications.

Minimum Operating Temperature: -40 °C

The wide operating temperature range ensures functionality in harsh conditions, ideal for outdoor and rugged applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and corrosion resistance, enhancing reliability over time.

Terminal Position: QUAD

The quad terminal configuration allows for more compact and organized PCB designs.

Maximum Seated Height: 1 mm

The low seated height makes it suitable for applications where height is a critical factor.

Width: 4 mm

A compact width keeps the PCB layout concise, facilitating efficient space utilization.

Output Polarity: COMPLEMENTARY

Complementary output can be beneficial in differential signaling applications, improving noise resistance.

Minimum Supply Voltage (Vsup): 3 V

Flexibility in supply voltage range supports a variety of designs, from battery-operated to higher voltage circuits.

Maximum Time At Peak Reflow Temperature (s): 30

The specified reflow time ensures compatibility with modern soldering techniques and long-term reliability.

Peak Reflow Temperature °C: 260

A high peak reflow temperature allows for robust soldering processes, suitable for high-performance applications.

Length: 4 mm

Similar to its width, the compact length aids in space-constrained designs.

Temperature Grade: INDUSTRIAL

Industrial grade indicates durability and reliability, making it suitable for long-term operational environments.

Technology: ECL

ECL (Emitter Coupled Logic) technology allows for high-speed operation, making it ideal for high-performance digital circuits.

Terminal Form: NO LEAD

No lead terminal form reduces PCB footprint and allows for more versatile placement options.

Packing Method: RAIL

Rail packing ensures safe handling and easy integration into automated assembly processes.

Terminal Pitch: 0.5 mm

A tight terminal pitch enables a more compact design, which is advantageous for high-density applications.

Maximum Supply Voltage (Vsup): 5.5 V

The capability to handle a maximum supply voltage of 5.5V broadens its use in various electronic systems.

Maximum Power Supply Current (ICC): 65 mA

With a maximum power supply current of 65 mA, this product can effectively drive multiple load conditions without failure.

Technical Specifications

Multiplexer & Demultiplexer MC10EP57MNG attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3.0V TO -5.5V;

Family:

10E

JESD-30 Code:

S-XQCC-N20

JESD-609 Code:

e3

Length:

4 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC20,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Maximum Power Supply Current (ICC):

65 mA

Propagation Delay At Nominal Supply:

.52 ns

Propagation Delay (tpd):

.475 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

MC10EP57MNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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