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MC10E195FNR2

Onsemi

MC10E195FNR2 by Onsemi

MC10E195FNR2 by Onsemi is a delay line with 4.72ns propagation delay at 5V, ECL technology, and 127 taps/steps. It is used for high-speed signal processing in applications requiring precise timing control and programmable delays.

Median Price

$3.858

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,431 parts In-Stock

1+ parts

-

100+ parts

$3.430

1k+ parts

$3.070

10k+ parts

$2.890

1,431

-

$3.430

$3.070

$2.890

Verical

USA . 1,431 parts In-Stock

1+ parts

-

100+ parts

$4.287

1k+ parts

$3.837

10k+ parts

$3.612

1,431

-

$4.287

$3.837

$3.612

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,240 parts In-Stock

1+ parts

$2.910

100+ parts

-

1k+ parts

-

10k+ parts

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2,240

$2.910

-

-

-

Digiode

USA . 2,444 parts In-Stock

1+ parts

$3.629

100+ parts

-

1k+ parts

-

10k+ parts

-

2,444

$3.629

-

-

-

A2Z Electronics, Inc.

USA . 187 parts In-Stock

1+ parts

-

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187

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Bristol Electronics

USA . 187 parts In-Stock

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-

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187

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 260 parts In-Stock

1+ parts

$2.910

100+ parts

-

1k+ parts

-

10k+ parts

-

260

$2.910

-

-

-

Corphita

USA . 375 parts In-Stock

1+ parts

$3.438

100+ parts

-

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-

10k+ parts

-

375

$3.438

-

-

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SupplyDigital Components

Austria . 7,886 parts In-Stock

1+ parts

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100+ parts

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7,886

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Microchip USA

USA . 5,478 parts In-Stock

1+ parts

-

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5,478

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Kulean Microsystems

USA . 4,413 parts In-Stock

1+ parts

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4,413

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TANS Electronics

Latvia . 2,404 parts In-Stock

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2,404

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Continental Prestige Electronics

USA . 1,431 parts In-Stock

1+ parts

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100+ parts

$4.590

1k+ parts

-

10k+ parts

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1,431

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$4.590

-

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Problanco Electronics

Mexico . 825 parts In-Stock

1+ parts

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825

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UHIMA Technologies

Türkiye . 578 parts In-Stock

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578

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Perfect Parts

USA . 9 parts In-Stock

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9

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Overview

Experience the superior quality and precision of the MC10E195FNR2 by Onsemi, a top-tier manufacturer in the industry. This delay line offers unparalleled performance and reliability for a wide range of applications. From telecommunications to industrial automation, this product delivers unmatched value and benefits to customers seeking advanced timing solutions. Trust in Onsemi's expertise and innovation to take your projects to the next level with the MC10E195FNR2.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and resistance to environmental factors, making the product reliable in various conditions.

Propagation Delay At Nominal Supply: 4.72 ns

Low propagation delay ensures fast signal transmission, making the product suitable for applications requiring quick response times.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V ensures compatibility with common power sources and other components in the system.

Technology: ECL

Employing Emitter-Coupled Logic technology offers high-speed operation and low power consumption, making the product suitable for high-performance applications.

Programmable Delay Line: YES

Being programmable allows for flexibility in adjusting delay times, making the product versatile and adaptable to different system requirements.

Technical Specifications

Delay Lines MC10E195FNR2 attributes and parameters. Explore more Delay Lines devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V

Family:

10E

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

Length:

11.505 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Taps/Steps:

127

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

235

Power Supplies (V):

-5.2

Maximum Power Supply Current (ICC):

156 mA

Programmable Delay Line:

YES

Propagation Delay At Nominal Supply:

4.72 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Delay Lines

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Nominal Total Delay (td):

3.63 ns

Width:

11.505 mm

Trade Compliance

MC10E195FNR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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