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SN54LS31J

Texas Instruments

SN54LS31J by Texas Instruments

SN54LS31J by Texas Instruments is a TTL delay line with 48ns propagation delay at 5V. It has 16 terminals, operates b/w -55 to 125 °C, and offers a total delay of 105ns. Ideal for military applications requiring precise signal timing in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,483 parts In-Stock

1+ parts

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6,483

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Digiode

USA . 1,421 parts In-Stock

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1,421

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,137 parts In-Stock

1+ parts

$7.000

100+ parts

-

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1,137

$7.000

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AZTECH Wire

Italy . 741 parts In-Stock

1+ parts

$15.067

100+ parts

-

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741

$15.067

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Parana Technologies

USA . 214 parts In-Stock

1+ parts

$20.494

100+ parts

-

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$20.558

10k+ parts

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214

$20.494

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$20.558

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DigiPath Technology Company

USA . 1,250 parts In-Stock

1+ parts

$22.566

100+ parts

$20.761

1k+ parts

-

10k+ parts

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1,250

$22.566

$20.761

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ChromeModa Solutions

Germany . 4,015 parts In-Stock

1+ parts

$23.027

100+ parts

$18.882

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4,015

$23.027

$18.882

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IDEA Electronic Components Group

UK . 495 parts In-Stock

1+ parts

$23.027

100+ parts

$21.876

1k+ parts

$20.724

10k+ parts

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495

$23.027

$21.876

$20.724

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Corphita

USA . 3,873 parts In-Stock

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3,873

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Overview

Discover the high-quality SN54LS31J delay line by Texas Instruments, a leading manufacturer known for reliability and innovation. Ideal for a variety of applications, this product offers customers exceptional value with its precise performance, fast propagation delay, and wide operating temperature range. Whether you need accurate signal timing in military-grade equipment or industrial automation systems, the SN54LS31J delivers superior results every time. Trust Texas Instruments to provide top-notch solutions for your electronic needs.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed package body material provides durability and protection for the internal components, ensuring a longer lifespan for the delay line.

Propagation Delay At Nominal Supply: 48 ns

The low propagation delay of 48 ns ensures fast signal transmission, making this delay line suitable for applications where timing precision is crucial.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common supply voltage of 5V makes this delay line compatible with a wide range of electronic systems and applications.

Load Capacitance (CL): 15 pF

The low load capacitance of 15 pF minimizes signal distortion and interference, resulting in accurate signal transmission.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this delay line can withstand harsh environmental conditions, making it suitable for industrial and military applications.

Technology: TTL

Utilizing TTL technology ensures reliable and efficient signal processing, making this delay line a dependable choice for various digital electronics applications.

Technical Specifications

Delay Lines SN54LS31J attributes and parameters. Explore more Delay Lines devices from Texas Instruments

Specs

Additional Features:

INVERTING, NON INVERTING AND NAND GATES ACTING AS DELAY ELEMENTS

Family:

LS

JESD-30 Code:

R-GDIP-T16

Length:

19.56 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Functions:

1

No. of Taps/Steps:

0

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

20 mA

Programmable Delay Line:

NO

Propagation Delay At Nominal Supply:

48 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Delay Lines

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Nominal Total Delay (td):

105 ns

Width:

7.62 mm

Trade Compliance

SN54LS31J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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