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SN54LS31W

Texas Instruments

SN54LS31W by Texas Instruments

SN54LS31W by Texas Instruments is a TTL delay line with 48ns propagation delay at 5V. It has a load capacitance of 15pF and operates in temperatures ranging from -55 to 125 °C. Ideal for military applications due to its flatpack style, it offers true output polarity and surface mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,933 parts In-Stock

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4,933

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Digiode

USA . 2,318 parts In-Stock

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-

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-

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2,318

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,425 parts In-Stock

1+ parts

$9.746

100+ parts

-

1k+ parts

$10.324

10k+ parts

-

1,425

$9.746

-

$10.324

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DigiPath Technology Company

USA . 214 parts In-Stock

1+ parts

$10.731

100+ parts

-

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-

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214

$10.731

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ChromeModa Solutions

Germany . 517 parts In-Stock

1+ parts

$10.950

100+ parts

$8.979

1k+ parts

-

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517

$10.950

$8.979

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IDEA Electronic Components Group

UK . 16 parts In-Stock

1+ parts

$10.950

100+ parts

$10.402

1k+ parts

$9.855

10k+ parts

-

16

$10.950

$10.402

$9.855

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One Stop Electronics

USA . 546 parts In-Stock

1+ parts

$15.000

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-

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546

$15.000

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AZTECH Wire

Italy . 723 parts In-Stock

1+ parts

$17.078

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723

$17.078

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Corphita

USA . 1,212 parts In-Stock

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Overview

Unlock the power of precision with the Texas Instruments SN54LS31W delay line. Crafted with superior quality and expertise, this delay line is a game-changer in the field of electronics. Designed for military-grade applications, this product boasts a nominal total delay of 105ns and a propagation delay of only 48ns at nominal supply voltage, ensuring optimal performance. With its compact size, flatpack package style, and dual terminal position, the SN54LS31W is perfect for a wide range of applications. Trust Texas Instruments to deliver top-notch products that provide value, reliability, and innovation to customers.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed package body material ensures durability and protection for the delay line, making it suitable for a wide range of applications.

Propagation Delay At Nominal Supply: 48 ns

With a low propagation delay, this delay line offers fast signal processing, making it ideal for time-sensitive applications.

Surface Mount: YES

Being surface mountable, this delay line is easy to integrate into circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage, this delay line is compatible with many common electronic systems.

Temperature Grade: MILITARY

Designed for military-grade applications, this delay line offers high performance and reliability in harsh environmental conditions.

Technology: TTL

Utilizing TTL (Transistor-Transistor Logic) technology, this delay line provides reliable signal processing and compatibility with TTL-based systems.

Technical Specifications

Delay Lines SN54LS31W attributes and parameters. Explore more Delay Lines devices from Texas Instruments

Specs

Additional Features:

INVERTING, NON INVERTING AND NAND GATES ACTING AS DELAY ELEMENTS

Family:

LS

JESD-30 Code:

R-GDFP-F16

Length:

9.79 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Functions:

1

No. of Taps/Steps:

0

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Equivalence Code:

FL16,.3

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

20 mA

Programmable Delay Line:

NO

Propagation Delay At Nominal Supply:

48 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Sub-Category:

Delay Lines

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Nominal Total Delay (td):

105 ns

Width:

6.755 mm

Trade Compliance

SN54LS31W Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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