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MC100E196FNR2

Onsemi

MC100E196FNR2 by Onsemi

MC100E196FNR2 by Onsemi is a delay line with 4.72ns propagation delay at 5V. It has 127 taps/steps, ECL technology, and programmable feature. Ideal for applications requiring precise timing control in electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,304 parts In-Stock

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Vyrian

USA . 190 parts In-Stock

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190

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Problanco Electronics

Mexico . 7,751 parts In-Stock

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TANS Electronics

Latvia . 7,341 parts In-Stock

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Kulean Microsystems

USA . 6,956 parts In-Stock

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Corphita

USA . 1,484 parts In-Stock

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SupplyDigital Components

Austria . 1,079 parts In-Stock

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UHIMA Technologies

Türkiye . 854 parts In-Stock

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854

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Corohmni

South Africa . 346 parts In-Stock

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Microchip USA

USA . 270 parts In-Stock

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Overview

Experience top-notch performance with the MC100E196FNR2 by Onsemi, a leading manufacturer in the industry. This delay line offers precise and reliable signal timing for a wide range of applications. Increase efficiency and accuracy in your projects with this high-quality product. Trust Onsemi to deliver innovative solutions that meet your needs. Elevate your designs with the MC100E196FNR2 and stay ahead of the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic epoxy material provides good protection and durability, making the product resistant to environmental factors.

Propagation Delay At Nominal Supply: 4.72 ns

Fast propagation delay ensures efficient signal transmission, making it suitable for high-speed applications.

Surface Mount: YES

Surface mount option allows for easy and convenient installation on PCBs, saving space and simplifying assembly.

Nominal Supply Voltage: 5V

Suitable voltage range ensures compatibility with common power supply systems, making it versatile for various applications.

Terminal Finish: TIN LEAD

Tin lead finish provides good conductivity and solderability, ensuring reliable connections for optimal performance.

Maximum Operating Temperature: 85 °C

High operating temperature range allows for reliable performance in various environments, increasing the product's versatility.

Programmable Delay Line: YES

Programmable delay line feature allows for customization and fine-tuning of delay settings, making it adaptable to different system requirements.

Technical Specifications

Delay Lines MC100E196FNR2 attributes and parameters. Explore more Delay Lines devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC=0 WITH VEE=-4.2 V TO -5.7 V

Family:

100E

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

Length:

11.505 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Taps/Steps:

127

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

235

Power Supplies (V):

-4.5

Maximum Power Supply Current (ICC):

179 mA

Programmable Delay Line:

YES

Propagation Delay At Nominal Supply:

4.72 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Delay Lines

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Nominal Total Delay (td):

3.63 ns

Width:

11.505 mm

Trade Compliance

MC100E196FNR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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