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MC100EP196BFAR2

Onsemi

MC100EP196BFAR2 by Onsemi

MC100EP196BFAR2 by Onsemi is a delay line with 15.25ns propagation delay, 1023 taps/steps, and ECL technology. It has a 32-terminal flatpack package suitable for industrial applications requiring precise signal timing control.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

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Kulean Microsystems

USA . 6,449 parts In-Stock

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TANS Electronics

Latvia . 4,207 parts In-Stock

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Problanco Electronics

Mexico . 3,386 parts In-Stock

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SupplyDigital Components

Austria . 1,810 parts In-Stock

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UHIMA Technologies

Türkiye . 874 parts In-Stock

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Overview

Transform your projects with the MC100EP196BFAR2 delay line from Onsemi. With a precision propagation delay of 15.25 ns, this product offers unparalleled accuracy and reliability for a wide range of applications. Onsemi's dedication to quality ensures that you are getting a top-of-the-line product that will exceed your expectations. Whether you're working on telecommunications, data communications, or industrial control systems, this delay line will provide the value, benefits, and advantages you need to succeed. Upgrade your designs today with the MC100EP196BFAR2.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the delay line.

Propagation Delay At Nominal Supply: 15.25 ns

Offers low propagation delay, ensuring efficiency and accuracy in signal transmission.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 3.3

Standard supply voltage for compatibility with a wide range of electronic systems.

No. of Terminals: 32

Provides multiple connection points for versatile integration with other components.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial applications.

Output Polarity: COMPLEMENTARY

Ensures compatibility with different types of circuits and systems.

Technology: ECL

Utilizes Emitter-Coupled Logic technology for fast and reliable signal processing.

Programmable Delay Line: YES

Allows for customizable delay settings, making it versatile for various timing requirements.

Technical Specifications

Delay Lines MC100EP196BFAR2 attributes and parameters. Explore more Delay Lines devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC=0 WITH VEE=-3.0 V TO -3.6 V

Family:

100E

JESD-30 Code:

S-PQFP-G32

Length:

7 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Taps/Steps:

1023

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

+-3.3

Maximum Power Supply Current (ICC):

175 mA

Programmable Delay Line:

YES

Propagation Delay At Nominal Supply:

15.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Delay Lines

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Nominal Total Delay (td):

12.4 ns

Width:

7 mm

Trade Compliance

MC100EP196BFAR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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