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MC10E1652FNR2G

Onsemi

MC10E1652FNR2G by Onsemi

MC10E1652FNR2G by Onsemi is a digital arithmetic circuit with 2 functions, operating at 5V. It has a propagation delay of 1.075ns and operates in temperatures ranging from 0 to 85 °C. This chip carrier package is ideal for applications requiring fast signal processing in electronic systems.

Median Price

$25.038

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 20,131 parts In-Stock

1+ parts

-

100+ parts

$20.030

1k+ parts

$17.920

10k+ parts

$16.860

20,131

-

$20.030

$17.920

$16.860

DigiKey

USA . 20,131 parts In-Stock

1+ parts

-

100+ parts

$26.350

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-

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-

20,131

-

$26.350

-

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Verical

USA . 4,980 parts In-Stock

1+ parts

-

100+ parts

$25.038

1k+ parts

$22.400

10k+ parts

$21.075

4,980

-

$25.038

$22.400

$21.075

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,921 parts In-Stock

1+ parts

$21.128

100+ parts

-

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1,921

$21.128

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Vyrian

USA . 3,513 parts In-Stock

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3,513

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Distributors (Availability)

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AZTECH Wire

Italy . 171 parts In-Stock

1+ parts

$11.050

100+ parts

-

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171

$11.050

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Corphita

USA . 1,747 parts In-Stock

1+ parts

$20.016

100+ parts

-

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1,747

$20.016

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Corohmni

South Africa . 102 parts In-Stock

1+ parts

$22.240

100+ parts

-

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102

$22.240

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QUARKTWIN TECHNOLOGY LTD

USA . 21,202 parts In-Stock

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21,202

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Continental Prestige Electronics

USA . 20,131 parts In-Stock

1+ parts

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100+ parts

$18.470

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20,131

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$18.470

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Microchip USA

USA . 6,530 parts In-Stock

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6,530

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TANS Electronics

Latvia . 5,893 parts In-Stock

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5,893

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Problanco Electronics

Mexico . 5,143 parts In-Stock

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5,143

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Kulean Microsystems

USA . 3,677 parts In-Stock

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3,677

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SupplyDigital Components

Austria . 2,610 parts In-Stock

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2,610

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UHIMA Technologies

Türkiye . 425 parts In-Stock

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425

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Overview

Unlock the power of digital arithmetic circuits with the MC10E1652FNR2G by Onsemi. Known for their high-quality products, Onsemi delivers top-notch performance and reliability. This versatile chip carrier package is perfect for a wide range of applications, offering fast propagation delay of just 1.075 ns and an operating temperature range from 0 to 85 °C. With complementary output polarity and a nominal supply voltage of 5V, this device provides unmatched value and efficiency for your digital circuit needs. Experience the advantages of Onsemi technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

Nominal Supply Voltage (Vsup): 5V

Operating at a standard 5V supply voltage ensures compatibility with common power sources in electronic devices.

Propagation Delay (tpd): 1.075 ns

The low propagation delay of 1.075 ns ensures high-speed performance in arithmetic calculations, making it suitable for demanding applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, the product can withstand elevated temperatures without compromising performance, suitable for industrial environments.

Output Polarity: COMPLEMENTARY

The complementary output polarity allows for versatile integration with other circuit components, enhancing the flexibility of the overall system design.

Technology: ECL

Utilizing Emitter-Coupled Logic (ECL) technology offers high-speed operation and low power consumption, making it ideal for high-performance applications.

Technical Specifications

Digital Arithmetic Circuits MC10E1652FNR2G attributes and parameters. Explore more Digital Arithmetic Circuits devices from Onsemi

Specs

Family:

10E

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e3

Length:

8.965 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

1.075 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8.965 mm

Trade Compliance

MC10E1652FNR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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