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MC10E1651FNR2G

Onsemi

MC10E1651FNR2G by Onsemi

MC10E1651FNR2G by Onsemi is a Digital Arithmetic Circuit with 2 functions, operating at 5V. It has a fast propagation delay of 1.075 ns and operates in temperatures ranging from 0 to 85 °C. Ideal for applications requiring high-speed arithmetic calculations in electronic systems.

Median Price

$23.410

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 402 parts In-Stock

1+ parts

$17.740

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-

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402

$17.740

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Chip1Stop

Japan . 402 parts In-Stock

1+ parts

$18.700

100+ parts

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402

$18.700

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Rochester

USA . 29,844 parts In-Stock

1+ parts

-

100+ parts

$28.120

1k+ parts

$25.160

10k+ parts

$23.680

29,844

-

$28.120

$25.160

$23.680

DigiKey

USA . 29,844 parts In-Stock

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29,844

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Verical

USA . 10,415 parts In-Stock

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100+ parts

$35.150

1k+ parts

$31.450

10k+ parts

$29.600

10,415

-

$35.150

$31.450

$29.600

Distributors (In-Stock)

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Digiode

USA . 2,234 parts In-Stock

1+ parts

$16.853

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2,234

$16.853

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Vyrian

USA . 2,550 parts In-Stock

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2,550

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Zilex Electronics Inc.

Canada . 20 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 982 parts In-Stock

1+ parts

$14.970

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982

$14.970

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Corphita

USA . 1,291 parts In-Stock

1+ parts

$15.966

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$15.966

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Corohmni

South Africa . 99 parts In-Stock

1+ parts

$17.740

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99

$17.740

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$22.396

100+ parts

$20.380

1k+ parts

$18.365

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1,000

$22.396

$20.380

$18.365

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Continental Prestige Electronics

USA . 29,844 parts In-Stock

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$25.960

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$25.960

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QUARKTWIN TECHNOLOGY LTD

USA . 28,723 parts In-Stock

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28,723

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Kulean Microsystems

USA . 7,506 parts In-Stock

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SupplyDigital Components

Austria . 7,369 parts In-Stock

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Microchip USA

USA . 5,471 parts In-Stock

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Problanco Electronics

Mexico . 4,435 parts In-Stock

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TANS Electronics

Latvia . 2,766 parts In-Stock

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Perfect Parts

USA . 2,615 parts In-Stock

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UHIMA Technologies

Türkiye . 710 parts In-Stock

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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GreenTree Electronics

Israel . 467 parts In-Stock

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467

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Overview

Experience the cutting-edge technology of the MC10E1651FNR2G by Onsemi, a top-tier manufacturer known for superior quality and innovation in digital arithmetic circuits. This versatile product offers unmatched performance and reliability in various applications, providing customers with seamless functionality and efficiency. Elevate your projects with the value and benefits that this product brings, ensuring optimal results and satisfaction every time. Trust in Onsemi to deliver excellence with the MC10E1651FNR2G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the circuits, making the product long-lasting and reliable.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into various electronic designs.

No. of Functions: 2

Having multiple functions in a single package increases the versatility and efficiency of the product.

Nominal Supply Voltage / Vsup (V): 5

Operating at a 5V supply voltage is common and compatible with many electronic systems.

Propagation Delay (tpd): 1.075 ns

Low propagation delay ensures fast signal processing and high-speed performance.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable operation in a wide range of environments.

Output Polarity: COMPLEMENTARY

Complementary output polarity enhances the product's compatibility with other digital circuits and systems.

Technology: ECL

ECL (Emitter-Coupled Logic) technology offers high-speed operation and low power consumption for efficient performance.

Technical Specifications

Digital Arithmetic Circuits MC10E1651FNR2G attributes and parameters. Explore more Digital Arithmetic Circuits devices from Onsemi

Specs

Family:

10E

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e3

Length:

8.965 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

1.075 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8.965 mm

Trade Compliance

MC10E1651FNR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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