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MC100LVEL51DTG

Onsemi

MC100LVEL51DTG by Onsemi

MC100LVEL51DTG by Onsemi is a ECL technology latch with 0.52 ns propagation delay, 3.3V supply voltage, and 2900 MHz max frequency. Ideal for industrial applications requiring fast positive edge triggering in a compact thin profile package.

Median Price

$3.522

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,504 parts In-Stock

1+ parts

-

100+ parts

$3.130

1k+ parts

$2.800

10k+ parts

$2.630

6,504

-

$3.130

$2.800

$2.630

Verical

USA . 3,051 parts In-Stock

1+ parts

-

100+ parts

$3.913

1k+ parts

$3.500

10k+ parts

$3.288

3,051

-

$3.913

$3.500

$3.288

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 755 parts In-Stock

1+ parts

$3.306

100+ parts

-

1k+ parts

-

10k+ parts

-

755

$3.306

-

-

-

Vyrian

USA . 5,630 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,630

-

-

-

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Cogito LLC

Ukraine . 4 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 983 parts In-Stock

1+ parts

$3.132

100+ parts

-

1k+ parts

-

10k+ parts

-

983

$3.132

-

-

-

Corohmni

South Africa . 397 parts In-Stock

1+ parts

$3.480

100+ parts

-

1k+ parts

-

10k+ parts

-

397

$3.480

-

-

-

Component Stockers USA

USA . 7,215 parts In-Stock

1+ parts

$3.610

100+ parts

$3.390

1k+ parts

$3.060

10k+ parts

-

7,215

$3.610

$3.390

$3.060

-

AZTECH Wire

Italy . 234 parts In-Stock

1+ parts

$10.600

100+ parts

-

1k+ parts

-

10k+ parts

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234

$10.600

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 25,722 parts In-Stock

1+ parts

-

100+ parts

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25,722

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Continental Prestige Electronics

USA . 6,503 parts In-Stock

1+ parts

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100+ parts

$2.950

1k+ parts

-

10k+ parts

-

6,503

-

$2.950

-

-

Kulean Microsystems

USA . 6,119 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,119

-

-

-

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Problanco Electronics

Mexico . 4,565 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,565

-

-

-

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Microchip USA

USA . 4,102 parts In-Stock

1+ parts

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1k+ parts

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4,102

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TANS Electronics

Latvia . 1,755 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,755

-

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Kepictronics

USA . 1,287 parts In-Stock

1+ parts

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100+ parts

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1,287

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SupplyDigital Components

Austria . 629 parts In-Stock

1+ parts

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100+ parts

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629

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Perfect Parts

USA . 224 parts In-Stock

1+ parts

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224

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UHIMA Technologies

Türkiye . 193 parts In-Stock

1+ parts

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193

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Overview

Unlock the power of cutting-edge technology with the MC100LVEL51DTG by Onsemi. As a leader in the industry, Onsemi guarantees top-notch quality and reliability in every product they create. This latches & flip-flops category gem offers lightning-fast propagation delay of 0.52ns, making it ideal for high-speed applications. With a compact design and industrial-grade temperature range, this product ensures optimal performance in any environment. Trust Onsemi to deliver unmatched value and benefits to customers looking for seamless integration and superior functionality in their projects. Elevate your designs with the MC100LVEL51DTG today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the latch or flip-flop, making it suitable for long-term use in various applications.

Propagation Delay At Nominal Supply: 0.55 ns

With a fast propagation delay of 0.55 ns, this latch or flip-flop can process signals quickly, making it ideal for high-speed applications where timing is critical.

Surface Mount: YES

Being surface mountable saves space and allows for easy integration onto PCBs, making this latch or flip-flop a convenient choice for compact designs.

Package Shape: SQUARE

The square package shape is versatile and can fit neatly into various circuit layouts, enhancing the efficiency and aesthetics of the overall design.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V, this latch or flip-flop is compatible with standard power sources, making it a practical choice for a wide range of electronic systems.

Power Supplies (V): -3.3

With a negative power supply of -3.3V, this latch or flip-flop can handle dual power configurations, offering flexibility in circuit design and operation.

No. of Terminals: 8

Having 8 terminals provides ample connectivity options for input and output signals, allowing for versatile use in complex digital circuits.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style saves space on the PCB and ensures efficient thermal performance, making this latch or flip-flop suitable for modern compact designs.

Propagation Delay (tpd): 0.52 ns

The low propagation delay of 0.52 ns ensures high-speed signal processing, making this latch or flip-flop ideal for applications that require quick response times.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this latch or flip-flop can withstand elevated temperatures, ensuring reliable performance in harsh environmental conditions.

Trigger Type: POSITIVE EDGE

The positive edge trigger type is commonly used in digital systems for clocking signals, allowing for precise control and synchronization of data flow.

Minimum Operating Temperature: -40 °C

The wide temperature range from -40 °C to 85°C enables this latch or flip-flop to operate in both extreme cold and hot conditions, increasing its versatility and reliability.

Terminal Finish: TIN

The use of tin terminal finish enhances solderability and conductivity, ensuring stable connections and reliable performance in the latch or flip-flop.

Terminal Position: DUAL

Having dual terminal positions provides flexibility in PCB layout and installation, allowing for various mounting options to accommodate different design requirements.

Maximum Seated Height: 1.1 mm

The low seated height of 1.1 mm reduces the overall profile of the latch or flip-flop, making it suitable for slim and compact electronic devices.

Width: 3 mm

The compact width of 3 mm allows for efficient use of space on the PCB, enabling dense and intricate circuit designs without compromising on performance.

Output Polarity: COMPLEMENTARY

Having complementary output polarity ensures balanced signal levels and facilitates precise logic operations in digital circuits, enhancing the functionality of the latch or flip-flop.

Minimum Supply Voltage (Vsup): 3 V

Operating at a minimum supply voltage of 3V ensures consistent performance and reliable operation, making this latch or flip-flop suitable for various low-power applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds allows for efficient soldering processes, ensuring proper assembly and reliable connectivity of the latch or flip-flop.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260 °C, this latch or flip-flop can withstand high-temperature soldering processes, ensuring durable and robust connections on the PCB.

Length: 3 mm

The compact length of 3 mm contributes to the overall space-saving design of the latch or flip-flop, making it suitable for applications with limited board real estate.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this latch or flip-flop can operate reliably in demanding environments with varying temperature ranges and conditions, ensuring rugged performance.

Maximum Frequency At Nominal Supply: 2900000000 Hz

With a maximum frequency of 2.9 GHz at nominal supply voltage, this latch or flip-flop is capable of handling high-speed data processing, making it suitable for advanced digital systems.

Technology: ECL

Based on Emitter-Coupled Logic (ECL) technology, this latch or flip-flop offers fast switching speeds and low power consumption, making it ideal for high-performance electronic applications.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy installation and rework processes on the PCB, ensuring efficient assembly and maintenance of the latch or flip-flop.

Packing Method: RAIL

The rail packing method provides secure packaging and handling of the latch or flip-flop during transportation and storage, minimizing the risk of damage and ensuring product integrity.

Terminal Pitch: 0.65 mm

With a narrow terminal pitch of 0.65 mm, this latch or flip-flop allows for compact layout designs and high-density integration on the PCB, optimizing space utilization.

Minimum fmax: 2800 MHz

With a minimum fmax of 2800 MHz, this latch or flip-flop can operate at high frequencies, enabling rapid data processing and efficient performance in advanced digital systems.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates that this latch or flip-flop has moderate sensitivity to moisture, ensuring proper handling and storage to prevent component damage.

Maximum Supply Voltage (Vsup): 3.8 V

Operating within a maximum supply voltage of 3.8V, this latch or flip-flop offers a safe operating range, protecting the component from overvoltage conditions and ensuring long-term reliability.

Maximum Power Supply Current (ICC): 37 mA

With a maximum power supply current of 37 mA, this latch or flip-flop consumes low power, making it energy-efficient and suitable for battery-powered or low-power applications.

Technical Specifications

Latches & Flip-Flops MC100LVEL51DTG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -3.8V

Family:

100LVEL

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

2900000000 Hz

Moisture Sensitivity Level (MSL):

3

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

-3.3

Maximum Power Supply Current (ICC):

37 mA

Propagation Delay At Nominal Supply:

.55 ns

Propagation Delay (tpd):

.52 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3 mm

Minimum fmax:

2800 MHz

Trade Compliance

MC100LVEL51DTG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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