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MC100LVEL51DG

Onsemi

MC100LVEL51DG by Onsemi

MC100LVEL51DG by Onsemi is a high-speed ECL flip-flop with 0.52 ns propagation delay at 3.3V, suitable for industrial applications. It features positive edge trigger, complementary output polarity, and operates b/w -40 to 85°C. With a max supply voltage of 3.8V and peak reflow temperature of 260°C, it offers reliable performance in compact small outline packaging.

Median Price

$5.404

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 66 parts In-Stock

1+ parts

$6.520

100+ parts

-

1k+ parts

-

10k+ parts

-

66

$6.520

-

-

-

Mouser Electronics

USA . 115 parts In-Stock

1+ parts

$8.390

100+ parts

$4.940

1k+ parts

$4.300

10k+ parts

$3.740

115

$8.390

$4.940

$4.300

$3.740

Rochester

USA . 19,653 parts In-Stock

1+ parts

-

100+ parts

$3.430

1k+ parts

$3.070

10k+ parts

$2.890

19,653

-

$3.430

$3.070

$2.890

Verical

USA . 10,472 parts In-Stock

1+ parts

-

100+ parts

$4.287

1k+ parts

$3.837

10k+ parts

$3.612

10,472

-

$4.287

$3.837

$3.612

Flip Electronics (Authorized)

USA . 7,546 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,546

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,023 parts In-Stock

1+ parts

$3.629

100+ parts

-

1k+ parts

-

10k+ parts

-

1,023

$3.629

-

-

-

Vyrian

USA . 12,433 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,433

-

-

-

-

Flip Electronics

USA . 7,546 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

7,546

-

-

-

-

Chip Stock

USA . 3,960 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,960

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 190 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

190

-

-

-

-

Semi Source

USA . 80 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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80

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 7,462 parts In-Stock

1+ parts

$3.250

100+ parts

-

1k+ parts

-

10k+ parts

-

7,462

$3.250

-

-

-

Corphita

USA . 1,546 parts In-Stock

1+ parts

$3.438

100+ parts

-

1k+ parts

-

10k+ parts

-

1,546

$3.438

-

-

-

Corohmni

South Africa . 323 parts In-Stock

1+ parts

$3.820

100+ parts

-

1k+ parts

-

10k+ parts

-

323

$3.820

-

-

-

Component Stockers USA

USA . 26,952 parts In-Stock

1+ parts

$4.090

100+ parts

$3.850

1k+ parts

$3.480

10k+ parts

$3.480

26,952

$4.090

$3.850

$3.480

$3.480

AZTECH Wire

Italy . 12,433 parts In-Stock

1+ parts

$5.970

100+ parts

$5.730

1k+ parts

$5.620

10k+ parts

$5.510

12,433

$5.970

$5.730

$5.620

$5.510

Microchip USA

USA . 1,412 parts In-Stock

1+ parts

$19.430

100+ parts

$19.150

1k+ parts

$19.020

10k+ parts

$18.880

1,412

$19.430

$19.150

$19.020

$18.880

TANS Electronics

Latvia . 7,575 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,575

-

-

-

-

Kulean Microsystems

USA . 6,238 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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6,238

-

-

-

-

Problanco Electronics

Mexico . 2,809 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,809

-

-

-

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Perfect Parts

USA . 1,021 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,021

-

-

-

-

Cyclops Electronics Ltd (Excess)

UK . 190 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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190

-

-

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Glotronic Ltd.

UK . 152 parts In-Stock

1+ parts

-

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152

-

-

-

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SupplyDigital Components

Austria . 79 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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79

-

-

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UHIMA Technologies

Türkiye . 6 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6

-

-

-

-

Overview

Boost your electronics projects with the MC100LVEL51DG by Onsemi! As a leading manufacturer in the industry, Onsemi delivers top-quality latches & flip-flops that guarantee exceptional performance and reliability. This versatile component is ideal for a wide range of applications, offering customers unmatched value and benefits. With a fast propagation delay and complimentary output polarity, the MC100LVEL51DG is designed to meet the demands of industrial-grade projects. Upgrade your designs today with Onsemi's innovative technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and can withstand environmental factors, making the latch or flip-flop reliable for long-term use.

Propagation Delay At Nominal Supply: 0.59 ns

The low propagation delay ensures fast response times, ideal for high-speed applications.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V supply voltage is common and compatible with many systems, making it easy to integrate this latch or flip-flop.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can function reliably in a variety of environments.

Output Characteristics: OPEN-EMITTER

The open-emitter output allows for flexible circuit design and compatibility with various other components.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures that this latch or flip-flop can operate in both extreme cold and hot conditions.

Technology: ECL

ECL technology offers high-speed operation and low power consumption, making this product efficient and reliable.

Technical Specifications

Latches & Flip-Flops MC100LVEL51DG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -3.8V

Family:

100LVEL

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-3.3

Maximum Power Supply Current (ICC):

37 mA

Propagation Delay At Nominal Supply:

.59 ns

Propagation Delay (tpd):

.52 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

2800 MHz

Trade Compliance

MC100LVEL51DG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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