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MC100EP56DT

Onsemi

MC100EP56DT by Onsemi

MC100EP56DT by Onsemi is a 2:1 MUX/DEMUX with 0.47 ns propagation delay, operating at -40 to 85 °C. It has 20 terminals, ECL technology, and supports Vsup from 3V to 5.5V. Ideal for high-speed signal routing in industrial applications due to its low delay and wide voltage range support.

Median Price

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Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,480 parts In-Stock

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Legend Electronics Inc.

USA . 1,097 parts In-Stock

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Digiode

USA . 1,060 parts In-Stock

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Prism Electronics

USA . 459 parts In-Stock

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459

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Bristol Electronics

USA . 284 parts In-Stock

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LWI Electronics Inc

India . 86 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 60 parts In-Stock

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Semi Source

USA . 59 parts In-Stock

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Sea View Technologies

USA . 35 parts In-Stock

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Speed Components Ltd

Israel . 16 parts In-Stock

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AZTECH Wire

Italy . 149 parts In-Stock

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$16.670

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SupplyDigital Components

Austria . 7,650 parts In-Stock

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Kulean Microsystems

USA . 5,836 parts In-Stock

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TANS Electronics

Latvia . 3,855 parts In-Stock

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Problanco Electronics

Mexico . 3,236 parts In-Stock

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Corphita

USA . 2,283 parts In-Stock

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UHIMA Technologies

Türkiye . 496 parts In-Stock

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Corohmni

South Africa . 297 parts In-Stock

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Microchip USA

USA . 227 parts In-Stock

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Kepictronics

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Perfect Parts

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Schahn Electronic Components

Germany . 44 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 20 parts In-Stock

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Overview

Upgrade your electronic designs with the MC100EP56DT by Onsemi. This high-quality multiplexer & demultiplexer offers lightning-fast propagation delays, compact packaging, and industrial-grade temperature tolerance. With Onsemi's reputation for reliability and innovation, you can trust that this product will deliver outstanding performance in a variety of applications. From telecommunications to data networking, the MC100EP56DT provides value, efficiency, and precision, making it an essential component for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection, making the product durable and reliable.

Propagation Delay At Nominal Supply: 0.5 ns

Offers fast signal processing, allowing for efficient data transmission.

Surface Mount: YES

Facilitates easy and convenient installation on circuit boards.

No. of Functions: 2

Allows for multiplexing or demultiplexing of two input signals, increasing versatility.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common voltage level, suitable for various applications.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments.

Technology: ECL

Utilizes Emitter-Coupled Logic for high-speed performance and low power consumption.

Technical Specifications

Multiplexer & Demultiplexer MC100EP56DT attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Additional Features:

NECL MODE OPERATING RANGE: VCC = 0 V WITH VEE = -3.0 V TO -5.5 V

Family:

100E

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

SERIES-RESISTOR

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Maximum Power Supply Current (ICC):

80 mA

Propagation Delay At Nominal Supply:

.5 ns

Propagation Delay (tpd):

.47 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

4.4 mm

Trade Compliance

MC100EP56DT Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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