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MC100EP51DTR2

Onsemi

MC100EP51DTR2 by Onsemi

MC100EP51DTR2 by Onsemi is a high-speed ECL flip-flop with a propagation delay of 0.45 ns, suitable for industrial applications. It operates at a nominal voltage of 3.3V and has a max frequency of 3GHz, making it ideal for fast signal processing in electronic systems requiring precise timing control. With its small outline package and surface-mount capability, this device offers compact design flexibility while ensuring reliable performance in temperature ranges from -40 °C to 85°C.

Median Price

$5.780

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 128 parts In-Stock

1+ parts

-

100+ parts

$4.990

1k+ parts

$4.460

10k+ parts

$4.200

128

-

$4.990

$4.460

$4.200

DigiKey

USA . 128 parts In-Stock

1+ parts

-

100+ parts

$5.780

1k+ parts

-

10k+ parts

-

128

-

$5.780

-

-

Verical

USA . 128 parts In-Stock

1+ parts

-

100+ parts

$6.237

1k+ parts

$5.575

10k+ parts

$5.250

128

-

$6.237

$5.575

$5.250

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,483 parts In-Stock

1+ parts

$5.282

100+ parts

-

1k+ parts

-

10k+ parts

-

2,483

$5.282

-

-

-

Vyrian

USA . 4,483 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,483

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 776 parts In-Stock

1+ parts

$5.004

100+ parts

-

1k+ parts

-

10k+ parts

-

776

$5.004

-

-

-

Corohmni

South Africa . 320 parts In-Stock

1+ parts

$5.560

100+ parts

-

1k+ parts

-

10k+ parts

-

320

$5.560

-

-

-

Advanced Electronics

New Zealand . 1,238 parts In-Stock

1+ parts

$9.585

100+ parts

$8.722

1k+ parts

$7.860

10k+ parts

-

1,238

$9.585

$8.722

$7.860

-

Kulean Microsystems

USA . 4,974 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,974

-

-

-

-

TANS Electronics

Latvia . 1,465 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,465

-

-

-

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SupplyDigital Components

Austria . 745 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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745

-

-

-

-

Microchip USA

USA . 277 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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277

-

-

-

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Problanco Electronics

Mexico . 255 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

255

-

-

-

-

Continental Prestige Electronics

USA . 128 parts In-Stock

1+ parts

-

100+ parts

$4.720

1k+ parts

-

10k+ parts

-

128

-

$4.720

-

-

UHIMA Technologies

Türkiye . 92 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

92

-

-

-

-

Overview

Unlock the possibilities with the MC100EP51DTR2 by Onsemi, a top-quality latches & flip-flops component designed to meet your specific needs. Onsemi's reputation for excellence ensures that you are getting a reliable and durable product. Perfect for a wide range of applications, this versatile component offers unparalleled value, benefits, and advantages to customers. Experience seamless performance and efficiency with the MC100EP51DTR2, making it the ideal choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the latch, ensuring long-lasting performance.

Propagation Delay At Nominal Supply: 0.5 ns

The fast propagation delay ensures quick response times, making this latch ideal for high-speed applications.

Surface Mount: YES

The surface mount capability makes installation easy and efficient, saving time and effort during assembly.

Package Shape: SQUARE

The square shape allows for efficient use of space on PCBs, maximizing the number of latches that can be accommodated in a limited area.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V makes this latch compatible with a wide range of systems and applications.

Technology: ECL

Emitter-Coupled Logic technology provides high speed and low power consumption, making this latch suitable for demanding industrial applications.

Maximum Frequency At Nominal Supply: 3,000,000,000 Hz

The high maximum frequency capability allows for reliable operation in high-frequency circuits, ensuring consistent performance.

Technical Specifications

Latches & Flip-Flops MC100EP51DTR2 attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V

Family:

100E

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e0

Length:

3 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

3000000000 Hz

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

235

Power Supplies (V):

-4.5

Maximum Power Supply Current (ICC):

47 mA

Propagation Delay At Nominal Supply:

.5 ns

Propagation Delay (tpd):

.45 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

3 mm

Trade Compliance

MC100EP51DTR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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