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MC100EP29MNG

Onsemi

MC100EP29MNG by Onsemi

MC100EP29MNG by Onsemi is a 20-terminal ECL chip carrier with 2 functions, operating at -40 to 85 °C. It features 0.5 ns propagation delay, positive edge trigger, and complementary output polarity. Ideal for industrial applications requiring fast signal processing in a compact square package.

Median Price

$20.574

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 188 parts In-Stock

1+ parts

$22.260

100+ parts

$16.000

1k+ parts

-

10k+ parts

-

188

$22.260

$16.000

-

-

Mouser Electronics

USA . 218 parts In-Stock

1+ parts

$25.060

100+ parts

$17.110

1k+ parts

$16.570

10k+ parts

-

218

$25.060

$17.110

$16.570

-

DigiKey

USA . 148 parts In-Stock

1+ parts

$25.060

100+ parts

$17.634

1k+ parts

$16.486

10k+ parts

-

148

$25.060

$17.634

$16.486

-

Rochester

USA . 9,757 parts In-Stock

1+ parts

-

100+ parts

$15.110

1k+ parts

$13.520

10k+ parts

$12.720

9,757

-

$15.110

$13.520

$12.720

Verical

USA . 4,272 parts In-Stock

1+ parts

-

100+ parts

$18.887

1k+ parts

$16.900

10k+ parts

$15.900

4,272

-

$18.887

$16.900

$15.900

Arrow

USA . 10 parts In-Stock

1+ parts

-

100+ parts

$16.860

1k+ parts

$15.640

10k+ parts

-

10

-

$16.860

$15.640

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,283 parts In-Stock

1+ parts

$15.932

100+ parts

-

1k+ parts

-

10k+ parts

-

1,283

$15.932

-

-

-

Vyrian

USA . 3,342 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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3,342

-

-

-

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Flip Electronics

USA . 1,656 parts In-Stock

1+ parts

-

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-

1k+ parts

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1,656

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,076 parts In-Stock

1+ parts

$12.800

100+ parts

-

1k+ parts

-

10k+ parts

-

2,076

$12.800

-

-

-

Corphita

USA . 184 parts In-Stock

1+ parts

$15.093

100+ parts

-

1k+ parts

-

10k+ parts

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184

$15.093

-

-

-

Corohmni

South Africa . 181 parts In-Stock

1+ parts

$16.770

100+ parts

-

1k+ parts

-

10k+ parts

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181

$16.770

-

-

-

Microchip USA

USA . 5,211 parts In-Stock

1+ parts

$56.833

100+ parts

-

1k+ parts

-

10k+ parts

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5,211

$56.833

-

-

-

Problanco Electronics

Mexico . 8,364 parts In-Stock

1+ parts

-

100+ parts

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8,364

-

-

-

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Kulean Microsystems

USA . 8,101 parts In-Stock

1+ parts

-

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8,101

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-

-

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TANS Electronics

Latvia . 4,214 parts In-Stock

1+ parts

-

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4,214

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-

-

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SupplyDigital Components

Austria . 2,988 parts In-Stock

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2,988

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Perfect Parts

USA . 2,607 parts In-Stock

1+ parts

-

100+ parts

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2,607

-

-

-

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UHIMA Technologies

Türkiye . 633 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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633

-

-

-

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GreenTree Electronics

Israel . 259 parts In-Stock

1+ parts

-

100+ parts

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259

-

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Authorized Procurement Solutions

USA . 159 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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159

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Overview

Unlock the power of precision with the MC100EP29MNG from Onsemi. This high-quality latches & flip-flops product offers unparalleled reliability and performance for a wide range of applications. With its advanced technology and industrial-grade design, customers can trust in its durability and efficiency. Its compact square package shape and surface mount make it easy to integrate into any project. Experience the benefits of fast propagation delay, positive edge trigger type, and complementary output polarity. Choose the MC100EP29MNG for your next project and enjoy the value it brings to your designs.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and secure installation on a PCB, saving space and making it suitable for compact electronic devices.

No. of Functions: 2

Offers dual functionality in a single component, increasing efficiency and reducing the need for multiple separate components.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a commonly used supply voltage, ensuring compatibility with a wide range of systems and applications.

Propagation Delay (tpd): 0.5 ns

Provides fast response times for signal processing and data transfer, enhancing overall performance.

Trigger Type: POSITIVE EDGE

Supports precise triggering of functions based on the rising edge of the input signal, allowing for accurate synchronization in digital circuits.

Technology: ECL

Utilizes Emitter-Coupled Logic technology known for high-speed operation and low power consumption, ideal for demanding applications.

Technical Specifications

Latches & Flip-Flops MC100EP29MNG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V

Family:

100E

JESD-30 Code:

S-XQCC-N20

JESD-609 Code:

e3

Length:

4 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC20,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Propagation Delay (tpd):

.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

4 mm

Trade Compliance

MC100EP29MNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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